Contact Features Contact Underplating Material : Nickel Mating Pin Diameter : 1.47 MM [.058 INCH ] PCB Terminal Type : Receptacle Terminal Orientation : Flag Terminal Plating Material : Tin
Dimensions Accepts Insulation Diameter (Max) : 1.78 MM [.07 INCH ] Accepts Insulation Diameter Range : 1.14 - 1.78 MM [.045 - .07 INCH ] PCB Hole Diameter : 2.11 MM [.13 INCH ] Terminal Material Thickness : .25 MM [.01 INCH ] Wire Size (MMSQ) : .2 - .6 Wire Size (AWG) : 24 - 20
Mechanical Attachment Wire Insulation Support : With
Packaging Features Packaging Method : Bag Packaging Quantity : 1000
Product Type Features Terminal Features : Stud Hole Wire Insulation Support Retention Type : Open Barrel
Termination Features Product Terminates To : Wire & Cable Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
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Description
Contact Features Contact Underplating Material : Nickel Mating Pin Diameter : 1.47 MM [.058 INCH ] PCB Terminal Type : Receptacle Terminal Orientation : Flag Terminal Plating Material : Tin
Dimensions Accepts Insulation Diameter (Max) : 1.78 MM [.07 INCH ] Accepts Insulation Diameter Range : 1.14 - 1.78 MM [.045 - .07 INCH ] PCB Hole Diameter : 2.11 MM [.13 INCH ] Terminal Material Thickness : .25 MM [.01 INCH ] Wire Size (MMSQ) : .2 - .6 Wire Size (AWG) : 24 - 20
Mechanical Attachment Wire Insulation Support : With
Packaging Features Packaging Method : Bag Packaging Quantity : 1000
Product Type Features Terminal Features : Stud Hole Wire Insulation Support Retention Type : Open Barrel
Termination Features Product Terminates To : Wire & Cable Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features Contact Underplating Material : Nickel Mating Pin Diameter : 1.47 MM [.058 INCH ] PCB Terminal Type : Receptacle Terminal Orientation : Flag Terminal Plating Material : Tin
Dimensions Accepts Insulation Diameter (Max) : 1.78 MM [.07 INCH ] Accepts Insulation Diameter Range : 1.14 - 1.78 MM [.045 - .07 INCH ] PCB Hole Diameter : 2.11 MM [.13 INCH ] Terminal Material Thickness : .25 MM [.01 INCH ] Wire Size (MMSQ) : .2 - .6 Wire Size (AWG) : 24 - 20
Mechanical Attachment Wire Insulation Support : With
Packaging Features Packaging Method : Bag Packaging Quantity : 1000
Product Type Features Terminal Features : Stud Hole Wire Insulation Support Retention Type : Open Barrel
Termination Features Product Terminates To : Wire & Cable Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features
Contact Underplating Material : Nickel
Mating Pin Diameter : 1.47 MM [.058 INCH ]
PCB Terminal Type : Receptacle
Terminal Orientation : Flag
Terminal Plating Material : Tin
Dimensions
Accepts Insulation Diameter (Max) : 1.78 MM [.07 INCH ]
Accepts Insulation Diameter Range : 1.14 - 1.78 MM [.045 - .07 INCH ]
PCB Hole Diameter : 2.11 MM [.13 INCH ]
Terminal Material Thickness : .25 MM [.01 INCH ]
Wire Size (MMSQ) : .2 - .6
Wire Size (AWG) : 24 - 20
Mechanical Attachment
Wire Insulation Support : With
Packaging Features
Packaging Method : Bag
Packaging Quantity : 1000
Product Type Features
Terminal Features : Stud Hole
Wire Insulation Support Retention Type : Open Barrel
Termination Features
Product Terminates To : Wire & Cable
Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions
Insulation Option : Uninsulated
Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
