TE Connectivity Board-to-Board Connector Contacts 532823-1

Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 25 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Orientation : Right Angle Contact Type : Socket PCB Contact Termination Area Plating Material : Gold Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Tray Packaging Quantity : 25 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Usage Conditions Operating Temperature Range : -65 - 125 DEGC  [-85 - 257 DEGF ]