TE ConnectivityBoard-to-Board Connector Contacts5148513-1
Description
Contact Features Contact Base Material : Brass Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Orientation : Right Angle Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 2.54 MICM [100 MICIN ]
Mechanical Attachment Connector Mounting Type : Board Mount PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Carton Packaging Quantity : 25
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board Sealable : No
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
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Description
Contact Features Contact Base Material : Brass Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Orientation : Right Angle Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 2.54 MICM [100 MICIN ]
Mechanical Attachment Connector Mounting Type : Board Mount PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Carton Packaging Quantity : 25
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board Sealable : No
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Contact Features Contact Base Material : Brass Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Orientation : Right Angle Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 2.54 MICM [100 MICIN ]
Mechanical Attachment Connector Mounting Type : Board Mount PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Carton Packaging Quantity : 25
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board Sealable : No
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Contact Features
Contact Base Material : Brass
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Contact Orientation : Right Angle
Contact Type : Socket
Contact Underplating Material : Nickel
PCB Contact Termination Area Plating Material : Tin
PCB Contact Termination Area Plating Material Thickness : 2.54 MICM [100 MICIN ]
Mechanical Attachment
Connector Mounting Type : Board Mount
PCB Mount Retention : Without
Wire Insulation Support : Without
Operation/Application
Circuit Application : Power & Signal
Packaging Features
Packaging Method : Carton
Packaging Quantity : 25
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Cable-to-Board
Sealable : No
Termination Features
Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions
Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]