Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 1.2 Contact Mating Area Plating Material : Gold Flash Contact Mating Area Plating Material Thickness (MICIN) : 100 Contact Size : Size 20 Contact Type : Pin Contact Underplating Material : Nickel Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Tin
Dimensions Compatible Insulation Diameter Range : 1.27 - 1.52 MM [.05 - .06 INCH ] Wire Size (MMSQ) : .08 - .2 Wire Size (AWG) : 28 - 24
Identification Marking Contact Color Code : Black
Mechanical Attachment Contact Retention Type Within Housing : Snap-In Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 10000
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
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Description
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 1.2 Contact Mating Area Plating Material : Gold Flash Contact Mating Area Plating Material Thickness (MICIN) : 100 Contact Size : Size 20 Contact Type : Pin Contact Underplating Material : Nickel Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Tin
Dimensions Compatible Insulation Diameter Range : 1.27 - 1.52 MM [.05 - .06 INCH ] Wire Size (MMSQ) : .08 - .2 Wire Size (AWG) : 28 - 24
Identification Marking Contact Color Code : Black
Mechanical Attachment Contact Retention Type Within Housing : Snap-In Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 10000
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 1.2 Contact Mating Area Plating Material : Gold Flash Contact Mating Area Plating Material Thickness (MICIN) : 100 Contact Size : Size 20 Contact Type : Pin Contact Underplating Material : Nickel Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Tin
Dimensions Compatible Insulation Diameter Range : 1.27 - 1.52 MM [.05 - .06 INCH ] Wire Size (MMSQ) : .08 - .2 Wire Size (AWG) : 28 - 24
Identification Marking Contact Color Code : Black
Mechanical Attachment Contact Retention Type Within Housing : Snap-In Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 10000
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features
Contact Base Material : Brass
Contact Current Rating (Max) (AMP) : 1.2
Contact Mating Area Plating Material : Gold Flash
Contact Mating Area Plating Material Thickness (MICIN) : 100
Contact Size : Size 20
Contact Type : Pin
Contact Underplating Material : Nickel
Mating Pin Diameter : 1.02 MM [.04 INCH ]
PCB Contact Termination Area Plating Material : Tin
Dimensions
Compatible Insulation Diameter Range : 1.27 - 1.52 MM [.05 - .06 INCH ]
Wire Size (MMSQ) : .08 - .2
Wire Size (AWG) : 28 - 24
Identification Marking
Contact Color Code : Black
Mechanical Attachment
Contact Retention Type Within Housing : Snap-In
Wire Insulation Support : With
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Reel
Packaging Quantity : 10000
Termination Features
Product Terminates To : Wire & Cable
Termination Method to Wire & Cable : Crimp
Usage Conditions
Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
