Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold Flash
Electrical Characteristics Insulation Resistance (MEGO) : 5000
Operation/Applicatio
n Circuit Application : Power & Signal
Other Comment : Solder tab will accommodate a maximum of two 1.25-1.40 mm2- [16 AWG] solid wires, or two 0.80-0.90 mm2- [18 AWG] stranded wires.
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 5000
Product Type Features Connector & Contact Terminates To : Wire & Cable Connector System : Wire-to-Board Sealable : No
Termination Features Termination Method to Wire & Cable : Solder Eyelet
Usage Conditions Operating Temperature Range : -40 - 85 DEGC [-40 - 185 DEGF ]
Contact Features
- Contact Base Material : Phosphor Bronze
- Contact Current Rating (Max) (AMP) : 5
- Contact Mating Area Plating Material : Gold
- Contact Mating Area Plating Material Thickness (MICIN) : 15
- Contact Type : Socket
- Contact Underplating Material : Nickel
- PCB Contact Termination Area Plating Material : Gold Flash
Electrical Characteristics
- Insulation Resistance (MEGO) : 5000
Operation/Application
- Circuit Application : Power & Signal
Other
- Comment : Solder tab will accommodate a maximum of two 1.25-1.40 mm2- [16 AWG] solid wires, or two 0.80-0.90 mm2- [18 AWG] stranded wires.
Packaging Features
- Packaging Method : Loose Piece
- Packaging Quantity : 5000
Product Type Features
- Connector & Contact Terminates To : Wire & Cable
- Connector System : Wire-to-Board
- Sealable : No
Termination Features
- Termination Method to Wire & Cable : Solder Eyelet
Usage Conditions
- Operating Temperature Range : -40 - 85 DEGC [-40 - 185 DEGF ]
