Contact Features Contact Base Material : Copper Alloy Contact Length : 34.47 MM [1.357 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Retention Within Housing : With Contact Size : Size 12 Contact Type : Pin
Identification Marking Contact Color Code : None
Mechanical Attachment Contact Retention Type Within Housing : Press-Fit
Packaging Features Packaging Method : Package
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder Termination Method to Wire & Cable : Crimp
TE Connectivity
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Description
Contact Features Contact Base Material : Copper Alloy Contact Length : 34.47 MM [1.357 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Retention Within Housing : With Contact Size : Size 12 Contact Type : Pin
Identification Marking Contact Color Code : None
Mechanical Attachment Contact Retention Type Within Housing : Press-Fit
Packaging Features Packaging Method : Package
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder Termination Method to Wire & Cable : Crimp
Contact Features Contact Base Material : Copper Alloy Contact Length : 34.47 MM [1.357 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Retention Within Housing : With Contact Size : Size 12 Contact Type : Pin
Identification Marking Contact Color Code : None
Mechanical Attachment Contact Retention Type Within Housing : Press-Fit
Packaging Features Packaging Method : Package
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder Termination Method to Wire & Cable : Crimp
Contact Features
Contact Base Material : Copper Alloy
Contact Length : 34.47 MM [1.357 INCH ]
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Contact Retention Within Housing : With
Contact Size : Size 12
Contact Type : Pin
Identification Marking
Contact Color Code : None
Mechanical Attachment
Contact Retention Type Within Housing : Press-Fit
Packaging Features
Packaging Method : Package
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to Printed Circuit Board : Through Hole - Solder
