Contact Features Contact Mating Area Plating Material Thickness : 4 MICM [157.48 MICIN ] Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.3 MICM [51.18 MICIN ] Mating Tab Thickness : .8 MM [.032 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 4 MICM [157.48 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions Extension Below Board : 3.81 MM [.15 INCH ] PCB Hole Diameter : 1.5 MM [.059 INCH ] PCB Thickness (Recommended) : 1.6 MM [.062 INCH ] Profile Height from PCB : 10 MM [.394 INCH ] Terminal Material Thickness : .8 MM [.032 INCH ]
Mechanical Attachment Wire Insulation Support : With
Packaging Features Packaging Method : Reel Packaging Quantity : 15000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -30 - 110 DEGC [-22 - 230 DEGF ]
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Description
Contact Features Contact Mating Area Plating Material Thickness : 4 MICM [157.48 MICIN ] Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.3 MICM [51.18 MICIN ] Mating Tab Thickness : .8 MM [.032 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 4 MICM [157.48 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions Extension Below Board : 3.81 MM [.15 INCH ] PCB Hole Diameter : 1.5 MM [.059 INCH ] PCB Thickness (Recommended) : 1.6 MM [.062 INCH ] Profile Height from PCB : 10 MM [.394 INCH ] Terminal Material Thickness : .8 MM [.032 INCH ]
Mechanical Attachment Wire Insulation Support : With
Packaging Features Packaging Method : Reel Packaging Quantity : 15000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -30 - 110 DEGC [-22 - 230 DEGF ]
Contact Features Contact Mating Area Plating Material Thickness : 4 MICM [157.48 MICIN ] Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.3 MICM [51.18 MICIN ] Mating Tab Thickness : .8 MM [.032 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 4 MICM [157.48 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions Extension Below Board : 3.81 MM [.15 INCH ] PCB Hole Diameter : 1.5 MM [.059 INCH ] PCB Thickness (Recommended) : 1.6 MM [.062 INCH ] Profile Height from PCB : 10 MM [.394 INCH ] Terminal Material Thickness : .8 MM [.032 INCH ]
Mechanical Attachment Wire Insulation Support : With
Packaging Features Packaging Method : Reel Packaging Quantity : 15000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -30 - 110 DEGC [-22 - 230 DEGF ]
Contact Features
Contact Mating Area Plating Material Thickness : 4 MICM [157.48 MICIN ]
Contact Underplating Material : Nickel
Contact Underplating Material Thickness : 1.3 MICM [51.18 MICIN ]
Mating Tab Thickness : .8 MM [.032 INCH ]
Mating Tab Width : 6.35 MM [.25 INCH ]
PCB Contact Termination Area Plating Material Thickness : 4 MICM [157.48 MICIN ]
PCB Terminal Type : Tab
Terminal Orientation : Straight
Terminal Plating Material : Tin
Terminal Size : 6.35
Dimensions
Extension Below Board : 3.81 MM [.15 INCH ]
PCB Hole Diameter : 1.5 MM [.059 INCH ]
PCB Thickness (Recommended) : 1.6 MM [.062 INCH ]
Profile Height from PCB : 10 MM [.394 INCH ]
Terminal Material Thickness : .8 MM [.032 INCH ]
Mechanical Attachment
Wire Insulation Support : With
Packaging Features
Packaging Method : Reel
Packaging Quantity : 15000
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to PCB : Through Hole - Solder
Usage Conditions
Operating Temperature Range : -30 - 110 DEGC [-22 - 230 DEGF ]
