TE Connectivity Internal I/O Connectors 2333799-1

Configuration Features

• Number of Positions : 168
• Number of Rows : 2
• PCB Mount Orientation : Vertical

Contact Features

• Contact Base Material : Copper Alloy
• Contact Current Rating (Max) (AMP) : 1.1
• Contact Mating Area Plating Material : Gold (Au)
• Contact Mating Area Plating Material Thickness : .076 MICM  [3 MICIN ]
• Contact Underplating Material : Nickel
• PCB Contact Termination Area Plating Material : Tin

Housing Features

• Centerline (Pitch) : .6 MM  [.023 INCH ]

Industry Standards

• Industry Standard : OCP NIC 3.0, Gen-Z

Mechanical Attachment

• Connector Mounting Type : Board Mount

Operation/Application

• Circuit Application : Signal

Product Type Features

• Connector & Contact Terminates To : Printed Circuit Board
• Connector Mates With : PCB Edge Card
• Internal I/O Connector Type : Sliver for SFF-TA-1002

Termination Features

• Termination Method to PCB : Surface Mount

Usage Conditions

• Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]

Manufacturer: TE Connectivity AMP Connectors
Category: Connectors, Interconnects Card Edge Connectors Edgeboard Connectors
Series: Sliver 2.0
Pitch: 0.024" (0.60mm)
Features: Board Guide, Pick and Place, Solder Retention
Package: Tray
Gender: Female
Card Type: Non Specified - Dual Edge
Card Thickness: 0.062" (1.57mm)
Alternative Parts (Cross-Reference): Cross
Product Status: Active

"168 Position Female Connector Non Specified - Dual Edge Gold-Palladium 0.024"" (0.60mm) Black"

RCPT ASSY, VERT, 168 POS, SLIVER 2.0