TE ConnectivityHigh Speed Backplane Connectors2313237-3
Description
Configuration Features Backplane Architecture : Traditional Backplane Card Slot Centerline : 20.3 MM [.8 INCH ] Guide Location : Unguided Number of Columns : 16 Number of Ground Positions : 31 Number of Pairs : 20 Number of Positions : 112 Number of Power Positions : 6 Number of Rows : 7 Number of Signal Positions : 20 PCB Mount Orientation : Right Angle
Contact Features Contact Current Rating (Max) (AMP) : 1
Dimensions Row-to-Row Spacing : 1.35 MM [.053 INCH ]
Housing Features Centerline (Pitch) : 1.8 MM [.075 INCH ] Housing Material : LCP - GF (Liquid Crystal Polymer) Number of Shrouded Sides : 2
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Keyed
Operation/Applicatio
n Circuit Application : Power & Signal
Product Type Features Applied to Printed Circuit Board Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Shroud Style : Unshrouded Signal Arrangement : Differential Signaling & Single Ended
Signal Characteristics Differential Impedance (OHM) : 100 Number of Differential Pairs per Column : 2
Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 221 DEGF ]
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Description
Configuration Features Backplane Architecture : Traditional Backplane Card Slot Centerline : 20.3 MM [.8 INCH ] Guide Location : Unguided Number of Columns : 16 Number of Ground Positions : 31 Number of Pairs : 20 Number of Positions : 112 Number of Power Positions : 6 Number of Rows : 7 Number of Signal Positions : 20 PCB Mount Orientation : Right Angle
Contact Features Contact Current Rating (Max) (AMP) : 1
Dimensions Row-to-Row Spacing : 1.35 MM [.053 INCH ]
Housing Features Centerline (Pitch) : 1.8 MM [.075 INCH ] Housing Material : LCP - GF (Liquid Crystal Polymer) Number of Shrouded Sides : 2
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Keyed
Operation/Applicatio
n Circuit Application : Power & Signal
Product Type Features Applied to Printed Circuit Board Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Shroud Style : Unshrouded Signal Arrangement : Differential Signaling & Single Ended
Signal Characteristics Differential Impedance (OHM) : 100 Number of Differential Pairs per Column : 2
Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 221 DEGF ]
Configuration Features Backplane Architecture : Traditional Backplane Card Slot Centerline : 20.3 MM [.8 INCH ] Guide Location : Unguided Number of Columns : 16 Number of Ground Positions : 31 Number of Pairs : 20 Number of Positions : 112 Number of Power Positions : 6 Number of Rows : 7 Number of Signal Positions : 20 PCB Mount Orientation : Right Angle
Contact Features Contact Current Rating (Max) (AMP) : 1
Dimensions Row-to-Row Spacing : 1.35 MM [.053 INCH ]
Housing Features Centerline (Pitch) : 1.8 MM [.075 INCH ] Housing Material : LCP - GF (Liquid Crystal Polymer) Number of Shrouded Sides : 2
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Keyed
Operation/Applicatio
n Circuit Application : Power & Signal
Product Type Features Applied to Printed Circuit Board Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Shroud Style : Unshrouded Signal Arrangement : Differential Signaling & Single Ended
Signal Characteristics Differential Impedance (OHM) : 100 Number of Differential Pairs per Column : 2
Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 221 DEGF ]
Configuration Features
Backplane Architecture : Traditional Backplane
Card Slot Centerline : 20.3 MM [.8 INCH ]
Guide Location : Unguided
Number of Columns : 16
Number of Ground Positions : 31
Number of Pairs : 20
Number of Positions : 112
Number of Power Positions : 6
Number of Rows : 7
Number of Signal Positions : 20
PCB Mount Orientation : Right Angle
Contact Features
Contact Current Rating (Max) (AMP) : 1
Dimensions
Row-to-Row Spacing : 1.35 MM [.053 INCH ]
Housing Features
Centerline (Pitch) : 1.8 MM [.075 INCH ]
Housing Material : LCP - GF (Liquid Crystal Polymer)
Number of Shrouded Sides : 2
Mechanical Attachment
Connector Mounting Type : Board Mount
Mating Alignment : With
Mating Alignment Type : Keyed
Operation/Application
Circuit Application : Power & Signal
Product Type Features
Applied to Printed Circuit Board Type : Daughtercard
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Board
PCB Connector Assembly Type : PCB Mount Header
Shroud Style : Unshrouded
Signal Arrangement : Differential Signaling & Single Ended
Signal Characteristics
Differential Impedance (OHM) : 100
Number of Differential Pairs per Column : 2
Termination Features
Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions
Operating Temperature Range : -55 - 125 DEGC [-67 - 221 DEGF ]
