Contact Features Contact Base Material : Copper Contact Current Rating (Max) (AMP) : 110 Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Thickness : 5.08 - 7.62 MICM [200 - 300 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : Size 4 Contact Type : Pin Contact Underplating Material : Copper Contact Underplating Material Thickness : 2 MICM [78.74 MICIN ] Mating Pin Diameter : 6.35 MM [.25 INCH ]
Electrical Characteristics Operating Voltage (VAC) : 48 Operating Voltage (VDC) : 48
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tray Packaging Quantity : 48
Product Type Features Sealable : No
Termination Features Product Terminates To : Busbar
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Contact Features
- Contact Base Material : Copper
- Contact Current Rating (Max) (AMP) : 110
- Contact Mating Area Plating Material : Silver (Ag)
- Contact Mating Area Plating Material Thickness : 5.08 - 7.62 MICM [200 - 300 MICIN ]
- Contact Orientation : Straight
- Contact Retention Within Housing : Without
- Contact Size : Size 4
- Contact Type : Pin
- Contact Underplating Material : Copper
- Contact Underplating Material Thickness : 2 MICM [78.74 MICIN ]
- Mating Pin Diameter : 6.35 MM [.25 INCH ]
Electrical Characteristics
- Operating Voltage (VAC) : 48
- Operating Voltage (VDC) : 48
Mechanical Attachment
- Wire Insulation Support : Without
Operation/Application
- Circuit Application : Power
Packaging Features
- Packaging Method : Tray
- Packaging Quantity : 48
Product Type Features
Termination Features
- Product Terminates To : Busbar
Usage Conditions
- Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
