Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 32 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Thickness (MICIN) : 30 Contact Style : Standard Contact Type : Socket Contact Underplating Material : Nickel D-Sub Contact Size : 8 PCB Contact Termination Area Plating Material : Gold
Dimensions Post Diameter (MM) : .21 Wire Size (MMSQ) : 8 Wire Size (AWG) : 8
Operation/Applicatio
n Circuit Application : Power High Current : No
Other Comment : Use these contacts only with the Standard connectors. Do not use with Blindmate connectors.
Packaging Features Packaging Method : Loose Piece
Product Type Features Connector & Contact Terminates To : Wire & Cable Product Type : Contact
Termination Features Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
TE Connectivity
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Description
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 32 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Thickness (MICIN) : 30 Contact Style : Standard Contact Type : Socket Contact Underplating Material : Nickel D-Sub Contact Size : 8 PCB Contact Termination Area Plating Material : Gold
Dimensions Post Diameter (MM) : .21 Wire Size (MMSQ) : 8 Wire Size (AWG) : 8
Operation/Applicatio
n Circuit Application : Power High Current : No
Other Comment : Use these contacts only with the Standard connectors. Do not use with Blindmate connectors.
Packaging Features Packaging Method : Loose Piece
Product Type Features Connector & Contact Terminates To : Wire & Cable Product Type : Contact
Termination Features Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 32 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Thickness (MICIN) : 30 Contact Style : Standard Contact Type : Socket Contact Underplating Material : Nickel D-Sub Contact Size : 8 PCB Contact Termination Area Plating Material : Gold
Dimensions Post Diameter (MM) : .21 Wire Size (MMSQ) : 8 Wire Size (AWG) : 8
Operation/Applicatio
n Circuit Application : Power High Current : No
Other Comment : Use these contacts only with the Standard connectors. Do not use with Blindmate connectors.
Packaging Features Packaging Method : Loose Piece
Product Type Features Connector & Contact Terminates To : Wire & Cable Product Type : Contact
Termination Features Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Contact Features
Contact Base Material : Copper Alloy
Contact Current Rating (Max) (AMP) : 32
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Thickness (MICIN) : 30
Contact Style : Standard
Contact Type : Socket
Contact Underplating Material : Nickel
D-Sub Contact Size : 8
PCB Contact Termination Area Plating Material : Gold
Dimensions
Post Diameter (MM) : .21
Wire Size (MMSQ) : 8
Wire Size (AWG) : 8
Operation/Application
Circuit Application : Power
High Current : No
Other
Comment : Use these contacts only with the Standard connectors. Do not use with Blindmate connectors.
Packaging Features
Packaging Method : Loose Piece
Product Type Features
Connector & Contact Terminates To : Wire & Cable
Product Type : Contact
Termination Features
Termination Method to Wire & Cable : Crimp
Usage Conditions
Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
