TE Connectivity
Connector Contacts
211159-1
Description
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 32 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Size : Size 8 Contact Type : Pin Contact Underplating Material : Nickel Mating Pin Diameter : .14 MM [.006 INCH ] PCB Contact Termination Area Plating Material : Gold
Dimensions Wire Size (MMSQ) : 8 Wire Size (AWG) : 8
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 100
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp Termination Post & Tail Diameter : .2 MM [.007 INCH ] Termination Post & Tail Length : .23 MM [.01 INCH ]
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
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Description
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 32 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Size : Size 8 Contact Type : Pin Contact Underplating Material : Nickel Mating Pin Diameter : .14 MM [.006 INCH ] PCB Contact Termination Area Plating Material : Gold
Dimensions Wire Size (MMSQ) : 8 Wire Size (AWG) : 8
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 100
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp Termination Post & Tail Diameter : .2 MM [.007 INCH ] Termination Post & Tail Length : .23 MM [.01 INCH ]
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Request a Quote
Email Supplier
Suppliers
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 32 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Size : Size 8 Contact Type : Pin Contact Underplating Material : Nickel Mating Pin Diameter : .14 MM [.006 INCH ] PCB Contact Termination Area Plating Material : Gold
Dimensions Wire Size (MMSQ) : 8 Wire Size (AWG) : 8
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 100
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp Termination Post & Tail Diameter : .2 MM [.007 INCH ] Termination Post & Tail Length : .23 MM [.01 INCH ]
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : 32
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
- Contact Size : Size 8
- Contact Type : Pin
- Contact Underplating Material : Nickel
- Mating Pin Diameter : .14 MM [.006 INCH ]
- PCB Contact Termination Area Plating Material : Gold
Dimensions
- Wire Size (MMSQ) : 8
- Wire Size (AWG) : 8
Operation/Application
- Circuit Application : Power
Packaging Features
- Packaging Method : Bag
- Packaging Quantity : 100
Termination Features
- Product Terminates To : Wire & Cable
- Termination Method to Wire & Cable : Crimp
- Termination Post & Tail Diameter : .2 MM [.007 INCH ]
- Termination Post & Tail Length : .23 MM [.01 INCH ]
Usage Conditions
- Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
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Technical Specifications
|
Product Category
|
Wire Terminals |
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Product Number
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211159-1 |
|
Product Name
|
Connector Contacts |
|
Features
|
RoHS
|
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