Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 130 Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : Size 4 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 50 MICM [100 - 200 MICIN ] Mating Pin Diameter : 6.35 MM [.25 INCH ]
Electrical Characteristics Operating Voltage (VAC) : 250 Operating Voltage (VDC) : 250
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Box & Tray
Termination Features Product Terminates To : Busbar
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : 130
- Contact Mating Area Plating Material : Silver (Ag)
- Contact Mating Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ]
- Contact Orientation : Straight
- Contact Retention Within Housing : Without
- Contact Size : Size 4
- Contact Type : Pin
- Contact Underplating Material : Nickel
- Contact Underplating Material Thickness : 50 MICM [100 - 200 MICIN ]
- Mating Pin Diameter : 6.35 MM [.25 INCH ]
Electrical Characteristics
- Operating Voltage (VAC) : 250
- Operating Voltage (VDC) : 250
Operation/Application
- Circuit Application : Power
Packaging Features
- Packaging Method : Box & Tray
Termination Features
- Product Terminates To : Busbar
Usage Conditions
- Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
