Configuration Features Number of Positions : 52
Contact Features 端子のベース材質 : Brass Alloy Contact Mating Area Plating Material : Gold, Silver Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Retention Within Housing : Without Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.02 MICM [40 MICIN ] Wire Contact Termination Area Plating Material : Gold, Silver Wire Contact Termination Area Plating Material Finish : Bright Wire Contact Termination Area Plating Material Thickness : .76 MICM [30 MICIN ]
Electrical Characteristics Operating Voltage (VDC) : 250
Mechanical Attachment Connector Mounting Type : Board Mount Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Box
Product Type Features Connector System : Wire-to-Board Power Contact Type : Contact Sealable : No
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Configuration Features
Contact Features
- 端子のベース材質 : Brass Alloy
- Contact Mating Area Plating Material : Gold, Silver
- Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ]
- Contact Retention Within Housing : Without
- Contact Type : Pin
- Contact Underplating Material : Nickel
- Contact Underplating Material Thickness : 1.02 MICM [40 MICIN ]
- Wire Contact Termination Area Plating Material : Gold, Silver
- Wire Contact Termination Area Plating Material Finish : Bright
- Wire Contact Termination Area Plating Material Thickness : .76 MICM [30 MICIN ]
Electrical Characteristics
- Operating Voltage (VDC) : 250
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Wire Insulation Support : Without
Operation/Application
- Circuit Application : Power
Packaging Features
Product Type Features
- Connector System : Wire-to-Board
- Power Contact Type : Contact
- Sealable : No
Termination Features
- Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]