Contact Features Barrel Type : Open Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 13 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : With Contact Type : Socket Contact Underplating Material : Nickel Contact Underplating Material Thickness : .76 MICM [30 MICIN ] Mating Pin Diameter : 1.59 MM [.062 INCH ] Wire Contact Termination Area Plating Material : Gold Wire Contact Termination Area Plating Thickness : .25 MICM [10 MICIN ]
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Box Packaging Quantity : 100
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Solder Tab
Usage Conditions Operating Temperature Range : -55 - 150 DEGC [-67 - 302 DEGF ]
TE Connectivity
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Description
Contact Features Barrel Type : Open Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 13 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : With Contact Type : Socket Contact Underplating Material : Nickel Contact Underplating Material Thickness : .76 MICM [30 MICIN ] Mating Pin Diameter : 1.59 MM [.062 INCH ] Wire Contact Termination Area Plating Material : Gold Wire Contact Termination Area Plating Thickness : .25 MICM [10 MICIN ]
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Box Packaging Quantity : 100
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Solder Tab
Usage Conditions Operating Temperature Range : -55 - 150 DEGC [-67 - 302 DEGF ]
Contact Features Barrel Type : Open Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 13 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : With Contact Type : Socket Contact Underplating Material : Nickel Contact Underplating Material Thickness : .76 MICM [30 MICIN ] Mating Pin Diameter : 1.59 MM [.062 INCH ] Wire Contact Termination Area Plating Material : Gold Wire Contact Termination Area Plating Thickness : .25 MICM [10 MICIN ]
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Box Packaging Quantity : 100
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Solder Tab
Usage Conditions Operating Temperature Range : -55 - 150 DEGC [-67 - 302 DEGF ]
Contact Features
Barrel Type : Open
Contact Base Material : Brass
Contact Current Rating (Max) (AMP) : 13
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Contact Orientation : Straight
Contact Retention Within Housing : With
Contact Type : Socket
Contact Underplating Material : Nickel
Contact Underplating Material Thickness : .76 MICM [30 MICIN ]
Mating Pin Diameter : 1.59 MM [.062 INCH ]
Wire Contact Termination Area Plating Material : Gold
