TE Connectivity LGA Sockets 2-2822979-4

Description
Body Features Frame Style : Square Configuration Features Grid Spacing : .9906 x .8585 MM  [.039 x .0338 INCH ] Number of Positions : 3647 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 30 IC Socket Type : LGA 3647 Housing Features Centerline (Pitch) : .99 MM , .86 MM  [.034 INCH , .039 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : -25 - 100 DEGC  [-13 - 212 DEGF ]
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Description
Body Features Frame Style : Square Configuration Features Grid Spacing : .9906 x .8585 MM  [.039 x .0338 INCH ] Number of Positions : 3647 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 30 IC Socket Type : LGA 3647 Housing Features Centerline (Pitch) : .99 MM , .86 MM  [.034 INCH , .039 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : -25 - 100 DEGC  [-13 - 212 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
LGA Sockets - 2-2822979-4 - TE Connectivity
Berwyn, PA, United States
LGA Sockets
2-2822979-4
LGA Sockets 2-2822979-4
Body Features Frame Style : Square Configuration Features Grid Spacing : .9906 x .8585 MM  [.039 x .0338 INCH ] Number of Positions : 3647 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 30 IC Socket Type : LGA 3647 Housing Features Centerline (Pitch) : .99 MM , .86 MM  [.034 INCH , .039 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : -25 - 100 DEGC  [-13 - 212 DEGF ]

Body Features


  • Frame Style : Square

Configuration Features


  • Grid Spacing : .9906 x .8585 MM  [.039 x .0338 INCH ]
  • Number of Positions : 3647

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : .5
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Material Thickness (MICIN) : 30
  • IC Socket Type : LGA 3647

Housing Features


  • Centerline (Pitch) : .99 MM , .86 MM  [.034 INCH , .039 INCH ]
  • Housing Color : Black
  • Housing Material : High Temperature Thermoplastic

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount

Operation/Application


  • Circuit Application : Signal

Packaging Features


  • Packaging Method : Tray

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board

Termination Features


  • Termination Method to Printed Circuit Board : Surface Mount - Solder Ball

Usage Conditions


  • Operating Temperature Range : -25 - 100 DEGC  [-13 - 212 DEGF ]
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Technical Specifications

  TE Connectivity
Product Category IC Interconnect Components
Product Number 2-2822979-4
Product Name LGA Sockets
Product Type IC Socket
Socket Type LGA
Mounting Board Mount
Current Rating 0.5000 amps
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