Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 60 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .254 MICM [10 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.06 MICM [40 MICIN ] Mating Pin Diameter : 3.88 MM [.153 INCH ]
Electrical Characteristics Operating Voltage (VAC) : 60 Operating Voltage (VDC) : 60
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Carton Packaging Quantity : 300
Product Type Features Sealable : No
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features
- Contact Base Material : Brass
- Contact Current Rating (Max) (AMP) : 60
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness : .254 MICM [10 MICIN ]
- Contact Orientation : Straight
- Contact Retention Within Housing : Without
- Contact Type : Pin
- Contact Underplating Material : Nickel
- Contact Underplating Material Thickness : 1.06 MICM [40 MICIN ]
- Mating Pin Diameter : 3.88 MM [.153 INCH ]
Electrical Characteristics
- Operating Voltage (VAC) : 60
- Operating Voltage (VDC) : 60
Mechanical Attachment
- Wire Insulation Support : Without
Operation/Application
- Circuit Application : Power
Packaging Features
- Packaging Method : Carton
- Packaging Quantity : 300
Product Type Features
Termination Features
- Product Terminates To : Printed Circuit Board
- Termination Method to PCB : Through Hole - Press-Fit
Usage Conditions
- Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
