Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 35 Contact Mating Area Plating Material : Silver Contact Mating Area Plating Material Thickness : 5.08 - 7.62 MICM [200 - 300 MICIN ] Contact Orientation : Straight Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 50 MICM [1.27 MICIN ] Mating Pin Diameter : 3.17 MM [.125 INCH ] PCB Contact Termination Area Plating Material Finish : Bright
Electrical Characteristics Operating Voltage (VAC) : 250
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board Power Contact Type : Contact Sealable : No
Termination Features Termination Method to Printed Circuit Board : Through Hole - Screw
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : 35
- Contact Mating Area Plating Material : Silver
- Contact Mating Area Plating Material Thickness : 5.08 - 7.62 MICM [200 - 300 MICIN ]
- Contact Orientation : Straight
- Contact Type : Pin
- Contact Underplating Material : Nickel
- Contact Underplating Material Thickness : 50 MICM [1.27 MICIN ]
- Mating Pin Diameter : 3.17 MM [.125 INCH ]
- PCB Contact Termination Area Plating Material Finish : Bright
Electrical Characteristics
- Operating Voltage (VAC) : 250
Operation/Application
- Circuit Application : Power
Packaging Features
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Wire-to-Board
- Power Contact Type : Contact
- Sealable : No
Termination Features
- Termination Method to Printed Circuit Board : Through Hole - Screw
Usage Conditions
- Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]