Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Type : Socket Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] PCB Contact Termination Area Plating Material : Tin
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Box
Termination Features Termination Method to PCB : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
TE Connectivity
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Description
Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Type : Socket Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] PCB Contact Termination Area Plating Material : Tin
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Box
Termination Features Termination Method to PCB : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Type : Socket Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] PCB Contact Termination Area Plating Material : Tin
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Box
Termination Features Termination Method to PCB : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features
Contact Base Material : Copper Alloy
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ]
Contact Type : Socket
Contact Underplating Material : Nickel
Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ]
PCB Contact Termination Area Plating Material : Tin
Operation/Application
Circuit Application : Power
Packaging Features
Packaging Method : Box
Termination Features
Termination Method to PCB : Through Hole - Press-Fit
Usage Conditions
Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
