TE Connectivity
Connector Contacts
1766274-1
Description
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 200 Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Thickness : 5 MICM [200 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : Size 0 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Pin Diameter : 9.06 MM [.357 INCH ] Wire Contact Termination Area Plating Material : Silver Wire Contact Termination Area Plating Thickness : 5.08 - 7.62 MICM [200 - 300 MICIN ]
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 100
Termination Features Product Terminates To : Busbar
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
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Datasheet
Description
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 200 Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Thickness : 5 MICM [200 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : Size 0 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Pin Diameter : 9.06 MM [.357 INCH ] Wire Contact Termination Area Plating Material : Silver Wire Contact Termination Area Plating Thickness : 5.08 - 7.62 MICM [200 - 300 MICIN ]
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 100
Termination Features Product Terminates To : Busbar
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Request a Quote
Email Supplier
Datasheet
Suppliers
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 200 Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Thickness : 5 MICM [200 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : Size 0 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Pin Diameter : 9.06 MM [.357 INCH ] Wire Contact Termination Area Plating Material : Silver Wire Contact Termination Area Plating Thickness : 5.08 - 7.62 MICM [200 - 300 MICIN ]
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 100
Termination Features Product Terminates To : Busbar
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : 200
- Contact Mating Area Plating Material : Silver (Ag)
- Contact Mating Area Plating Material Thickness : 5 MICM [200 MICIN ]
- Contact Orientation : Straight
- Contact Retention Within Housing : Without
- Contact Size : Size 0
- Contact Type : Pin
- Contact Underplating Material : Nickel
- Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ]
- Mating Pin Diameter : 9.06 MM [.357 INCH ]
- Wire Contact Termination Area Plating Material : Silver
- Wire Contact Termination Area Plating Thickness : 5.08 - 7.62 MICM [200 - 300 MICIN ]
Mechanical Attachment
- Wire Insulation Support : Without
Operation/Application
- Circuit Application : Power
Packaging Features
- Packaging Method : Bag
- Packaging Quantity : 100
Termination Features
- Product Terminates To : Busbar
Usage Conditions
- Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
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Datasheet
Technical Specifications
|
Product Category
|
Wire Terminals |
|
Product Number
|
1766274-1 |
|
Product Name
|
Connector Contacts |
|
Features
|
RoHS
|
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