Body Features Finish : Tin Plating Thickness : 3.81 MICM [150 MICIN ]
Configuration Features Connection Capacity : Single Stud Hole : No Terminal Angle (DEG) : 180
Contact Features Contact Plating Material : Tin Contact Underplating Material : Copper Mating Tab Thickness : .81 MM [.032 INCH ] Mating Tab Width : 4.75 MM [.187 INCH ] PCB Terminal Type : Tab Terminal Orientation : Vertical Terminal Plating Material : Tin Terminal Size : 4.75
Dimensions Extension Below Board : 3.35 MM [.131 INCH ] PCB Hole Diameter : 1.25 MM [.049 INCH ] PCB Thickness (Recommended) : 1.6 - 2.39 MM [.063 - .094 INCH ] Profile Height from PCB : 9.7 MM [.38 INCH ] Receptacle Terminal Stock Thickness : .81 MM [.032 INCH ]
Other Comment : Brass Material.
Packaging Features Packaging Method : Bag Packaging Quantity : 1000
Product Type Features FASTON : Yes
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
TE Connectivity
Done
Request a Quote
Email Supplier
Description
Body Features Finish : Tin Plating Thickness : 3.81 MICM [150 MICIN ]
Configuration Features Connection Capacity : Single Stud Hole : No Terminal Angle (DEG) : 180
Contact Features Contact Plating Material : Tin Contact Underplating Material : Copper Mating Tab Thickness : .81 MM [.032 INCH ] Mating Tab Width : 4.75 MM [.187 INCH ] PCB Terminal Type : Tab Terminal Orientation : Vertical Terminal Plating Material : Tin Terminal Size : 4.75
Dimensions Extension Below Board : 3.35 MM [.131 INCH ] PCB Hole Diameter : 1.25 MM [.049 INCH ] PCB Thickness (Recommended) : 1.6 - 2.39 MM [.063 - .094 INCH ] Profile Height from PCB : 9.7 MM [.38 INCH ] Receptacle Terminal Stock Thickness : .81 MM [.032 INCH ]
Other Comment : Brass Material.
Packaging Features Packaging Method : Bag Packaging Quantity : 1000
Product Type Features FASTON : Yes
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Body Features Finish : Tin Plating Thickness : 3.81 MICM [150 MICIN ]
Configuration Features Connection Capacity : Single Stud Hole : No Terminal Angle (DEG) : 180
Contact Features Contact Plating Material : Tin Contact Underplating Material : Copper Mating Tab Thickness : .81 MM [.032 INCH ] Mating Tab Width : 4.75 MM [.187 INCH ] PCB Terminal Type : Tab Terminal Orientation : Vertical Terminal Plating Material : Tin Terminal Size : 4.75
Dimensions Extension Below Board : 3.35 MM [.131 INCH ] PCB Hole Diameter : 1.25 MM [.049 INCH ] PCB Thickness (Recommended) : 1.6 - 2.39 MM [.063 - .094 INCH ] Profile Height from PCB : 9.7 MM [.38 INCH ] Receptacle Terminal Stock Thickness : .81 MM [.032 INCH ]
Other Comment : Brass Material.
Packaging Features Packaging Method : Bag Packaging Quantity : 1000
Product Type Features FASTON : Yes
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Body Features
Finish : Tin
Plating Thickness : 3.81 MICM [150 MICIN ]
Configuration Features
Connection Capacity : Single
Stud Hole : No
Terminal Angle (DEG) : 180
Contact Features
Contact Plating Material : Tin
Contact Underplating Material : Copper
Mating Tab Thickness : .81 MM [.032 INCH ]
Mating Tab Width : 4.75 MM [.187 INCH ]
PCB Terminal Type : Tab
Terminal Orientation : Vertical
Terminal Plating Material : Tin
Terminal Size : 4.75
Dimensions
Extension Below Board : 3.35 MM [.131 INCH ]
PCB Hole Diameter : 1.25 MM [.049 INCH ]
PCB Thickness (Recommended) : 1.6 - 2.39 MM [.063 - .094 INCH ]
Profile Height from PCB : 9.7 MM [.38 INCH ]
Receptacle Terminal Stock Thickness : .81 MM [.032 INCH ]
Other
Comment : Brass Material.
Packaging Features
Packaging Method : Bag
Packaging Quantity : 1000
Product Type Features
FASTON : Yes
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions
Insulation Option : Uninsulated
Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]