Contact Features Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ] Contact Underplating Material : Brass Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Tab Thickness : 1.19 MM [.047 INCH ] Mating Tab Width : 9.53 MM [.375 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin
Dimensions PCB Hole Diameter : 4.49 MM [.117 INCH ] Stud Diameter : 4.5 MM [.177 INCH ] Terminal Material Thickness : 1.2 MM [.047 INCH ]
Packaging Features Packaging Method : Bag Packaging Quantity : 1000
Product Type Features Terminal Features : Stud Hole
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Screw
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
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Description
Contact Features Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ] Contact Underplating Material : Brass Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Tab Thickness : 1.19 MM [.047 INCH ] Mating Tab Width : 9.53 MM [.375 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin
Dimensions PCB Hole Diameter : 4.49 MM [.117 INCH ] Stud Diameter : 4.5 MM [.177 INCH ] Terminal Material Thickness : 1.2 MM [.047 INCH ]
Packaging Features Packaging Method : Bag Packaging Quantity : 1000
Product Type Features Terminal Features : Stud Hole
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Screw
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ] Contact Underplating Material : Brass Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Tab Thickness : 1.19 MM [.047 INCH ] Mating Tab Width : 9.53 MM [.375 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin
Dimensions PCB Hole Diameter : 4.49 MM [.117 INCH ] Stud Diameter : 4.5 MM [.177 INCH ] Terminal Material Thickness : 1.2 MM [.047 INCH ]
Packaging Features Packaging Method : Bag Packaging Quantity : 1000
Product Type Features Terminal Features : Stud Hole
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Screw
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features
Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ]
Contact Underplating Material : Brass
Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ]
Mating Tab Thickness : 1.19 MM [.047 INCH ]
Mating Tab Width : 9.53 MM [.375 INCH ]
PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ]
PCB Terminal Type : Tab
Terminal Orientation : Straight
Terminal Plating Material : Tin
Dimensions
PCB Hole Diameter : 4.49 MM [.117 INCH ]
Stud Diameter : 4.5 MM [.177 INCH ]
Terminal Material Thickness : 1.2 MM [.047 INCH ]
Packaging Features
Packaging Method : Bag
Packaging Quantity : 1000
Product Type Features
Terminal Features : Stud Hole
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to PCB : Through Hole - Screw
Usage Conditions
Insulation Option : Uninsulated
Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
