Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .8 MICM [31.496 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions Compatible Insulation Diameter Range : .5 - 1.02 MM [.02 - .04 INCH ] Wire Size (MMSQ) : .03 - .09 Wire Size (AWG) : 32 - 28
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 200
Product Type Features Applied Pressure : Standard
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
TE Connectivity
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Description
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .8 MICM [31.496 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions Compatible Insulation Diameter Range : .5 - 1.02 MM [.02 - .04 INCH ] Wire Size (MMSQ) : .03 - .09 Wire Size (AWG) : 32 - 28
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 200
Product Type Features Applied Pressure : Standard
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .8 MICM [31.496 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions Compatible Insulation Diameter Range : .5 - 1.02 MM [.02 - .04 INCH ] Wire Size (MMSQ) : .03 - .09 Wire Size (AWG) : 32 - 28
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 200
Product Type Features Applied Pressure : Standard
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Contact Features
Contact Base Material : Phosphor Bronze
Contact Current Rating (Max) (AMP) : 3
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .8 MICM [31.496 MICIN ]
Contact Orientation : Straight
Contact Type : Socket
PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions
Compatible Insulation Diameter Range : .5 - 1.02 MM [.02 - .04 INCH ]
Wire Size (MMSQ) : .03 - .09
Wire Size (AWG) : 32 - 28
Mechanical Attachment
PCB Mount Retention : Without
Wire Insulation Support : With
Operation/Application
Circuit Application : Power & Signal
Packaging Features
Packaging Method : Loose Piece
Packaging Quantity : 200
Product Type Features
Applied Pressure : Standard
Termination Features
Product Terminates To : Wire & Cable
Termination Method to Wire & Cable : Crimp
Usage Conditions
Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
