TE Connectivity
Connector Contacts
1650226-1
Description
Contact Features Contact Base Material : Copper Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : Size 20 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM [40 MICIN ] Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .76 MICM [30 MICIN ] Wire Contact Termination Area Plating Material : Gold
Dimensions Wire Size (AWG) : 24 - 20
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 250
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
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Datasheet
Description
Contact Features Contact Base Material : Copper Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : Size 20 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM [40 MICIN ] Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .76 MICM [30 MICIN ] Wire Contact Termination Area Plating Material : Gold
Dimensions Wire Size (AWG) : 24 - 20
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 250
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Request a Quote
Email Supplier
Datasheet
Suppliers
Contact Features Contact Base Material : Copper Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : Size 20 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM [40 MICIN ] Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .76 MICM [30 MICIN ] Wire Contact Termination Area Plating Material : Gold
Dimensions Wire Size (AWG) : 24 - 20
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 250
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features
- Contact Base Material : Copper
- Contact Current Rating (Max) (AMP) : 5
- Contact Mating Area Plating Material : Gold
- Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
- Contact Orientation : Straight
- Contact Retention Within Housing : Without
- Contact Size : Size 20
- Contact Type : Pin
- Contact Underplating Material : Nickel
- Contact Underplating Material Thickness : 1 MICM [40 MICIN ]
- Mating Pin Diameter : 1.02 MM [.04 INCH ]
- PCB Contact Termination Area Plating Material : Gold
- PCB Contact Termination Area Plating Material Thickness : .76 MICM [30 MICIN ]
- Wire Contact Termination Area Plating Material : Gold
Dimensions
- Wire Size (AWG) : 24 - 20
Mechanical Attachment
- Wire Insulation Support : Without
Operation/Application
- Circuit Application : Power
Packaging Features
- Packaging Method : Bag
- Packaging Quantity : 250
Termination Features
- Product Terminates To : Printed Circuit Board
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
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Datasheet
Technical Specifications
|
Product Category
|
Wire Terminals |
|
Product Number
|
1650226-1 |
|
Product Name
|
Connector Contacts |
|
Features
|
RoHS
|
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