Contact Features Contact Base Material : Copper Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : 20 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM [40 MICIN ] Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .76 MICM [30 MICIN ] Wire Contact Termination Area Plating Material : Gold
Dimensions Wire Size (AWG) : 24 - 20
Industry Standards Glow Wire Rating : Standard Part - Not Glow Wire
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Other Comment : PCB Termination Type - Premate
Packaging Features Packaging Method : Bag Packaging Quantity : 2500
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Power Contact Type : Contact
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
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Description
Contact Features Contact Base Material : Copper Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : 20 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM [40 MICIN ] Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .76 MICM [30 MICIN ] Wire Contact Termination Area Plating Material : Gold
Dimensions Wire Size (AWG) : 24 - 20
Industry Standards Glow Wire Rating : Standard Part - Not Glow Wire
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Other Comment : PCB Termination Type - Premate
Packaging Features Packaging Method : Bag Packaging Quantity : 2500
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Power Contact Type : Contact
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features Contact Base Material : Copper Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : 20 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM [40 MICIN ] Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .76 MICM [30 MICIN ] Wire Contact Termination Area Plating Material : Gold
Dimensions Wire Size (AWG) : 24 - 20
Industry Standards Glow Wire Rating : Standard Part - Not Glow Wire
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Other Comment : PCB Termination Type - Premate
Packaging Features Packaging Method : Bag Packaging Quantity : 2500
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Power Contact Type : Contact
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features
Contact Base Material : Copper
Contact Current Rating (Max) (AMP) : 5
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Contact Orientation : Straight
Contact Retention Within Housing : Without
Contact Size : 20
Contact Type : Pin
Contact Underplating Material : Nickel
Contact Underplating Material Thickness : 1 MICM [40 MICIN ]
Mating Pin Diameter : 1.02 MM [.04 INCH ]
PCB Contact Termination Area Plating Material : Gold
PCB Contact Termination Area Plating Material Thickness : .76 MICM [30 MICIN ]
Wire Contact Termination Area Plating Material : Gold
Dimensions
Wire Size (AWG) : 24 - 20
Industry Standards
Glow Wire Rating : Standard Part - Not Glow Wire
Mechanical Attachment
Wire Insulation Support : Without
Operation/Application
Circuit Application : Power
Other
Comment : PCB Termination Type - Premate
Packaging Features
Packaging Method : Bag
Packaging Quantity : 2500
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Power Contact Type : Contact
Termination Features
Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions
Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]