Contact Features Contact Mating Area Plating Material Thickness : 4 - 6 MICM [157.48 - 236.22 MICIN ] Contact Underplating Material : Nickel Contact Underplating Material Thickness : 2.5 MICM [98.42 MICIN ] Crimp Type : F-Crimp PCB Terminal Type : Receptacle Terminal Orientation : Straight Terminal Plating Material : Tin
Dimensions Compatible Insulation Diameter (Max) : 2.79 MM [.109 INCH ] Compatible Insulation Diameter Range : 1.52 - 2.79 MM [.059 - .109 INCH ] Extension Below Board : 1.83 MM [.072 INCH ] PCB Hole Diameter : 1.79 MM [.07 INCH ] PCB Thickness (Recommended) : 1.6 MM [.063 INCH ] Profile Height from PCB : 7.44 MM [.296 INCH ] Terminal Material Thickness : .25 MM [.01 INCH ] Wire Size (MMSQ) : .2 - .6 Wire Size (AWG) : 24 - 20
Mechanical Attachment Wire Insulation Support : With
Other Line : AMP-In-Mini
Packaging Features Packaging Method : Package Packaging Quantity : 6000
Product Type Features Wire Insulation Support Retention Type : Insulation Support
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -30 - 105 DEGC [-22 - 221 DEGF ]
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Description
Contact Features Contact Mating Area Plating Material Thickness : 4 - 6 MICM [157.48 - 236.22 MICIN ] Contact Underplating Material : Nickel Contact Underplating Material Thickness : 2.5 MICM [98.42 MICIN ] Crimp Type : F-Crimp PCB Terminal Type : Receptacle Terminal Orientation : Straight Terminal Plating Material : Tin
Dimensions Compatible Insulation Diameter (Max) : 2.79 MM [.109 INCH ] Compatible Insulation Diameter Range : 1.52 - 2.79 MM [.059 - .109 INCH ] Extension Below Board : 1.83 MM [.072 INCH ] PCB Hole Diameter : 1.79 MM [.07 INCH ] PCB Thickness (Recommended) : 1.6 MM [.063 INCH ] Profile Height from PCB : 7.44 MM [.296 INCH ] Terminal Material Thickness : .25 MM [.01 INCH ] Wire Size (MMSQ) : .2 - .6 Wire Size (AWG) : 24 - 20
Mechanical Attachment Wire Insulation Support : With
Other Line : AMP-In-Mini
Packaging Features Packaging Method : Package Packaging Quantity : 6000
Product Type Features Wire Insulation Support Retention Type : Insulation Support
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -30 - 105 DEGC [-22 - 221 DEGF ]
Contact Features Contact Mating Area Plating Material Thickness : 4 - 6 MICM [157.48 - 236.22 MICIN ] Contact Underplating Material : Nickel Contact Underplating Material Thickness : 2.5 MICM [98.42 MICIN ] Crimp Type : F-Crimp PCB Terminal Type : Receptacle Terminal Orientation : Straight Terminal Plating Material : Tin
Dimensions Compatible Insulation Diameter (Max) : 2.79 MM [.109 INCH ] Compatible Insulation Diameter Range : 1.52 - 2.79 MM [.059 - .109 INCH ] Extension Below Board : 1.83 MM [.072 INCH ] PCB Hole Diameter : 1.79 MM [.07 INCH ] PCB Thickness (Recommended) : 1.6 MM [.063 INCH ] Profile Height from PCB : 7.44 MM [.296 INCH ] Terminal Material Thickness : .25 MM [.01 INCH ] Wire Size (MMSQ) : .2 - .6 Wire Size (AWG) : 24 - 20
Mechanical Attachment Wire Insulation Support : With
Other Line : AMP-In-Mini
Packaging Features Packaging Method : Package Packaging Quantity : 6000
Product Type Features Wire Insulation Support Retention Type : Insulation Support
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -30 - 105 DEGC [-22 - 221 DEGF ]
Contact Features
Contact Mating Area Plating Material Thickness : 4 - 6 MICM [157.48 - 236.22 MICIN ]
Contact Underplating Material : Nickel
Contact Underplating Material Thickness : 2.5 MICM [98.42 MICIN ]
Crimp Type : F-Crimp
PCB Terminal Type : Receptacle
Terminal Orientation : Straight
Terminal Plating Material : Tin
Dimensions
Compatible Insulation Diameter (Max) : 2.79 MM [.109 INCH ]
Compatible Insulation Diameter Range : 1.52 - 2.79 MM [.059 - .109 INCH ]
Extension Below Board : 1.83 MM [.072 INCH ]
PCB Hole Diameter : 1.79 MM [.07 INCH ]
PCB Thickness (Recommended) : 1.6 MM [.063 INCH ]
Profile Height from PCB : 7.44 MM [.296 INCH ]
Terminal Material Thickness : .25 MM [.01 INCH ]
Wire Size (MMSQ) : .2 - .6
Wire Size (AWG) : 24 - 20
Mechanical Attachment
Wire Insulation Support : With
Other
Line : AMP-In-Mini
Packaging Features
Packaging Method : Package
Packaging Quantity : 6000
Product Type Features
Wire Insulation Support Retention Type : Insulation Support
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to PCB : Through Hole - Solder
Usage Conditions
Insulation Option : Uninsulated
Operating Temperature Range : -30 - 105 DEGC [-22 - 221 DEGF ]