Contact Features Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ] Contact Underplating Material : Copper or Nickel Contact Underplating Material Thickness : 2.54 MICM , 1.27 MICM [50 MICIN , 100 MICIN ] Mating Tab Thickness : .81 MM [.032 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions Extension Below Board : 3.81 MM [.15 INCH ] PCB Hole Diameter : 1.4 MM [.055 INCH ] PCB Thickness (Recommended) : 3.18 MM [.125 INCH ] Profile Height from PCB : 10.21 MM [.402 INCH ] Stud Diameter : 1.71 MM [.067 INCH ] Terminal Material Thickness : .8 MM [.031 INCH ]
Mechanical Attachment Wire Insulation Support : With
Packaging Features Packaging Method : Reel Packaging Quantity : 10000
Product Type Features Terminal Features : Stud Hole
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -30 - 110 DEGC [-22 - 230 DEGF ]
TE Connectivity
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Datasheet
Description
Contact Features Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ] Contact Underplating Material : Copper or Nickel Contact Underplating Material Thickness : 2.54 MICM , 1.27 MICM [50 MICIN , 100 MICIN ] Mating Tab Thickness : .81 MM [.032 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions Extension Below Board : 3.81 MM [.15 INCH ] PCB Hole Diameter : 1.4 MM [.055 INCH ] PCB Thickness (Recommended) : 3.18 MM [.125 INCH ] Profile Height from PCB : 10.21 MM [.402 INCH ] Stud Diameter : 1.71 MM [.067 INCH ] Terminal Material Thickness : .8 MM [.031 INCH ]
Mechanical Attachment Wire Insulation Support : With
Packaging Features Packaging Method : Reel Packaging Quantity : 10000
Product Type Features Terminal Features : Stud Hole
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -30 - 110 DEGC [-22 - 230 DEGF ]
Contact Features Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ] Contact Underplating Material : Copper or Nickel Contact Underplating Material Thickness : 2.54 MICM , 1.27 MICM [50 MICIN , 100 MICIN ] Mating Tab Thickness : .81 MM [.032 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions Extension Below Board : 3.81 MM [.15 INCH ] PCB Hole Diameter : 1.4 MM [.055 INCH ] PCB Thickness (Recommended) : 3.18 MM [.125 INCH ] Profile Height from PCB : 10.21 MM [.402 INCH ] Stud Diameter : 1.71 MM [.067 INCH ] Terminal Material Thickness : .8 MM [.031 INCH ]
Mechanical Attachment Wire Insulation Support : With
Packaging Features Packaging Method : Reel Packaging Quantity : 10000
Product Type Features Terminal Features : Stud Hole
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -30 - 110 DEGC [-22 - 230 DEGF ]
Contact Features
Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ]
