TE Connectivity RFI and EMI - Contacts, Fingerstock and Gaskets 114-0032-S

Description
ROUND TCS DIA3.2 L0.25M
  • RFI and EMI - Contacts, Fingerstock and Gaskets - 114-0032-S - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
Datasheet
Description
ROUND TCS DIA3.2 L0.25M
Datasheet

Suppliers

Company
Product
Description
Supplier Links
RFI and EMI - Contacts, Fingerstock and Gaskets - 114-0032-S - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
RFI and EMI - Contacts, Fingerstock and Gaskets
114-0032-S
RFI and EMI - Contacts, Fingerstock and Gaskets 114-0032-S
ROUND TCS DIA3.2 L0.25M

ROUND TCS DIA3.2 L0.25M

Buy Now Datasheet

Technical Specifications

  Quarktwin Technology Ltd.
Product Category Electrodes and Electrode Materials
Product Number 114-0032-S
Product Name RFI and EMI - Contacts, Fingerstock and Gaskets
Type Contact; Gasket
Unlock Full Specs
to access all available technical data

Similar Products

Battery Electrode Materials - PolyGrid® - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Battery Electrode Materials
PolyGrid®
Specs
OD / Width 12 to 48 inch (305 to 1219 mm)
Thickness 0.0020 to 0.0400 inch (0.0508 to 1.02 mm)
View Details
Positive-operation door contacts - AZ 08 - AZ 09 - AZ09 K - - Schmersal Inc.
Schmersal Inc.
Positive-operation door contacts - AZ 08 - AZ 09 - AZ09 K
Specs
Type Contact
View Details
RFI and EMI - Contacts, Fingerstock and Gaskets - 1212-FSA-0012 - Quarktwin Technology Ltd.
TE Connectivity
RFI and EMI - Contacts, Fingerstock and Gaskets
1212-FSA-0012
Specs
Type Contact; Gasket
Material Aluminum
Length 11.81 inch (300 mm)
View Details
MicroForm - .125” - Wallner Expac
Wallner Expac
MicroForm
.125”
Specs
Type Anode / Anode Material; Cathode / Cathode Material
Shape / Form Diamond
Plating / Coating Nickel (optional feature)
View Details