TE ConnectivityWire-to-Board Connector Contacts1-582355-3
Description
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 Contact Type : Tab Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin Wire Contact Termination Area Plating Material : Gold Wire Contact Termination Area Plating Thickness (MICIN) : 15
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 1000
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board
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Description
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 Contact Type : Tab Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin Wire Contact Termination Area Plating Material : Gold Wire Contact Termination Area Plating Thickness (MICIN) : 15
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 1000
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 Contact Type : Tab Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin Wire Contact Termination Area Plating Material : Gold Wire Contact Termination Area Plating Thickness (MICIN) : 15
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 1000
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board
Contact Features
Contact Base Material : Phosphor Bronze
Contact Current Rating (Max) (AMP) : 5
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness (MICIN) : 15
Contact Type : Tab
Contact Underplating Material : Nickel
PCB Contact Termination Area Plating Material : Tin
Wire Contact Termination Area Plating Material : Gold
Wire Contact Termination Area Plating Thickness (MICIN) : 15
Operation/Application
Circuit Application : Power & Signal
Packaging Features
Packaging Method : Loose Piece
Packaging Quantity : 1000
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
