TE Connectivity Board-to-Board Headers & Receptacles 1-1761614-3

Configuration Features

• Board-to-Board Configuration : Parallel
• Number of Positions : 200
• Number of Rows : 18
• PCB Mount Orientation : Vertical
• Stackable : Yes

Contact Features

• Contact Base Material : Copper Alloy
• Contact Current Rating (Max) (AMP) : 1
• Contact Layout : Matrix
• Contact Mating Area Plating Material : Gold
• Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ]
• Contact Shape & Form : Square, Dual Beam, Single Beam
• Contact Type : Tab
• Mating Tab Thickness : .2 MM  [.008 INCH ]
• Mating Tab Width : 1 MM  [.04 INCH ]
• PCB Contact Termination Area Plating Material : Tin-Lead

Dimensions

• Connector Height : 13.95 MM  [.548235 INCH ]
• PCB Thickness (Recommended) : 1.57 MM  [.8 INCH ]
• Row-to-Row Spacing : 2 MM  [.0786 INCH ]
• Stack Height : 24 MM , 28 MM , 18 MM  [1.102 INCH ]

Electrical Characteristics

• Dielectric Withstanding Voltage (Max) (VAC) : 500
• Insulation Resistance (MEGO) : 18
• Operating Voltage (VAC) : 48

Housing Features

• Centerline (Pitch) : 1.3 MM  [.051 INCH ]
• Housing Color : Natural
• Housing Material : Thermoplastic

Industry Standards

• UL Flammability Rating : UL 94V-0

Mechanical Attachment

• Connector Mounting Type : Board Mount
• Mating Alignment : Without
• Mating Retention : With
• PCB Mount Alignment : Without
• PCB Mount Retention : Without

Operation/Application

• Assembly Process Feature : None
• Circuit Application : Power & Signal

Packaging Features

• Packaging Method : Tray
• Packaging Quantity : 25

Product Type Features

• Connector & Contact Terminates To : Printed Circuit Board
• Connector System : Board-to-Board
• Header Type : Pin Header
• PCB Connector Assembly Type : PCB Mount Header
• Sealable : No

Termination Features

• Termination Method to Printed Circuit Board : Surface Mount - Solder Ball

Usage Conditions

• Operating Temperature Range : 0 - 100 DEGC  [32 - 212 DEGF ]