Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 104 Number of Rows : 18 PCB Mount Orientation : Vertical Stackable : Yes
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [29.9212 MICIN ] Contact Shape & Form : Single Beam, Dual Beam Contact Type : Socket Mating Tab Thickness : .2 MM [.008 INCH ] Mating Tab Width : 1 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions Connector Height : 16.65 MM [.654345 INCH ] PCB Thickness (Recommended) : 1.57 MM [.8 INCH ] Row-to-Row Spacing : 2 MM [.0786 INCH ] Stack Height : 36 MM , 24 MM , 26 MM , 23 MM , 21 MM , 31 MM [1.417 INCH ]
Electrical Characteristics Dielectric Withstanding Voltage (Max) (VAC) : 500 Insulation Resistance (MEGO) : 18 Operating Voltage (VAC) : 48
Housing Features Centerline (Pitch) : 1.3 MM [.051 INCH ] Housing Color : Natural Housing Material : Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Retention : With PCB Mount Alignment : Without PCB Mount Retention : Without
Operation/Applicatio
n Assembly Process Feature : None Circuit Application : Power & Signal
Packaging Features Packaging Method : Tray Packaging Quantity : 30
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Receptacle Sealable : No
Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball
Usage Conditions Operating Temperature Range : 0 - 100 DEGC [32 - 212 DEGF ]
Configuration Features
- Board-to-Board Configuration : Parallel
- Number of Positions : 104
- Number of Rows : 18
- PCB Mount Orientation : Vertical
- Stackable : Yes
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : 1
- Contact Layout : Matrix
- Contact Mating Area Plating Material : Gold
- Contact Mating Area Plating Material Thickness : .76 MICM [29.9212 MICIN ]
- Contact Shape & Form : Single Beam, Dual Beam
- Contact Type : Socket
- Mating Tab Thickness : .2 MM [.008 INCH ]
- Mating Tab Width : 1 MM [.04 INCH ]
- PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions
- Connector Height : 16.65 MM [.654345 INCH ]
- PCB Thickness (Recommended) : 1.57 MM [.8 INCH ]
- Row-to-Row Spacing : 2 MM [.0786 INCH ]
- Stack Height : 36 MM , 24 MM , 26 MM , 23 MM , 21 MM , 31 MM [1.417 INCH ]
Electrical Characteristics
- Dielectric Withstanding Voltage (Max) (VAC) : 500
- Insulation Resistance (MEGO) : 18
- Operating Voltage (VAC) : 48
Housing Features
- Centerline (Pitch) : 1.3 MM [.051 INCH ]
- Housing Color : Natural
- Housing Material : Thermoplastic
Industry Standards
- UL Flammability Rating : UL 94V-0
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Mating Alignment : Without
- Mating Retention : With
- PCB Mount Alignment : Without
- PCB Mount Retention : Without
Operation/Application
- Assembly Process Feature : None
- Circuit Application : Power & Signal
Packaging Features
- Packaging Method : Tray
- Packaging Quantity : 30
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Board-to-Board
- PCB Connector Assembly Type : PCB Mount Receptacle
- Sealable : No
Termination Features
- Termination Method to Printed Circuit Board : Surface Mount - Solder Ball
Usage Conditions
- Operating Temperature Range : 0 - 100 DEGC [32 - 212 DEGF ]
