T-Global Technology Co., Ltd. Thermal Compound, 30G, Container; Dispensing Method T Global S606C

Description
THERMAL COMPOUND, 30G, CONTAINER; Dispensing Method:Container; Volume:-; Weight:30g; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Compound, 30G, Container; Dispensing Method T Global - 68Y6492 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Compound, 30G, Container; Dispensing Method T Global
68Y6492
Thermal Compound, 30G, Container; Dispensing Method T Global 68Y6492
THERMAL COMPOUND, 30G, CONTAINER; Dispensing Method:Container; Volume:-; Weight:30g; Product Range:- RoHS Compliant: Yes

THERMAL COMPOUND, 30G, CONTAINER; Dispensing Method:Container; Volume:-; Weight:30g; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 68Y6492
Product Name Thermal Compound, 30G, Container; Dispensing Method T Global
Unlock Full Specs
to access all available technical data

Similar Products

Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability - EP5TC-80 - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Gap Filler, Foam in Place Gasket
View Details
Carbon Fiber Thermal Gap Fillers - CF210A - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Use Temperature -40 to 302 F (-40 to 150 C)
View Details
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed - QSil-553 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics; OEM or Industrial
Features Flame Retardant; UL Rating
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 374552 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Form / Shape 300 ml cartridge (10:2 ratio)
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details