3.5" SBC supports Intel® 11th Gen Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU, VGA, HDMI (or DP), eDP / LVDS, 3 x Intel Gb Ethernet, Audio, 2 x M.2, Touch Screen controller, 4DI / 4DO, 6 x USB, 4 x COM, 1 x Mini PCIe, 1 x SIM, Battery Charger, SMBus
LEX SYSTEM 3.5” Industrial embedded board3I110HW/BW is with 11th Gen. Intel® Tiger Lake-UP3 i7/i5/i3/Celeron processor which offers users powerful and flexible solution for industrial and embedded applications. 3I110HW/BW, equipped with 3 x GbE, 4 x RS232/RS422/485 serial ports, 7 x USB, 4 DI /4 DO, DP, HDMI ,VGA & LVDS with 1 x mPCIe, 2 x M.2 and 1 x SIM expansion slots. 3I110HW/BW's all wafer IO design delivers high flexibility toward expanded functions & and also provides user hassle-free solution of integrating the SBC board within various mechanical enclosures. Plus with battery charger features make this platform well suited for reliability and mobility constrained AIoT applications, such as Medical Video Analysis, Intelligent Transportation, Factory Automation and Edge AI solutions.
Features:
11th Gen Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
2 x DDR4 SODIMM (Max. 64GB)
Multiple Independent display: VGA, HDMI (or DP), eDP or LVDS
3 x Intel GbE LAN, 6 x USB 2.0
4 x COM, 4DI / 4DO, 1 x Mini PCIe, 1 x SIM
1 x M.2 B Key, 1 x M.2 M Key
TPM 2.0 (Firmware), SMBus
Battery Charger Function (3I110BW)
OEM Option: DP (Type C), 1 x USB 3.0 (type C)
3.5" SBC supports Intel® 11th Gen Tiger Lake-UP3,
i7 / i5 / i3 / Celeron CPU, VGA, HDMI (or DP),
eDP / LVDS, 3 x Intel Gb Ethernet,
Audio, 2 x M.2, Touch Screen controller, 4DI / 4DO, 6 x USB,
4 x COM, 1 x Mini PCIe, 1 x SIM, Battery Charger, SMBus
LEX SYSTEM 3.5” Industrial embedded board3I110HW/BW is with 11th Gen. Intel® Tiger Lake-UP3 i7/i5/i3/Celeron processor which offers users powerful and flexible solution for industrial and embedded applications. 3I110HW/BW, equipped with 3 x GbE, 4 x RS232/RS422/485 serial ports, 7 x USB, 4 DI /4 DO, DP, HDMI ,VGA & LVDS with 1 x mPCIe, 2 x M.2 and 1 x SIM expansion slots. 3I110HW/BW's all wafer IO design delivers high flexibility toward expanded functions & and also provides user hassle-free solution of integrating the SBC board within various mechanical enclosures. Plus with battery charger features make this platform well suited for reliability and mobility constrained AIoT applications, such as Medical Video Analysis, Intelligent Transportation, Factory Automation and Edge AI solutions.
Features:
- 11th Gen Intel® Tiger Lake-UP3,
i7 / i5 / i3 / Celeron CPU
- 2 x DDR4 SODIMM (Max. 64GB)
- Multiple Independent display:
VGA, HDMI (or DP), eDP or LVDS
- 3 x Intel GbE LAN, 6 x USB 2.0
- 4 x COM, 4DI / 4DO, 1 x Mini PCIe, 1 x SIM
- 1 x M.2 B Key, 1 x M.2 M Key
- TPM 2.0 (Firmware), SMBus
- Battery Charger Function (3I110BW)
- OEM Option:
DP (Type C), 1 x USB 3.0 (type C)
