Swissbit AG Industrial BGA PCIe SSD, E2600, 20 GB, 3D PSLC Flash, -40°C to +85°C SE2600BC020GI-1TB1-1CB-STD

Description
PCIe M.2 1620 BGA PCIe Gen 3.1 / NVMe 1.3 4 lanes 291 Ball BGA, 0.8mm pitch 16 x 20mm high density 3D NAND TLC / pSLC Operational Temperature Range -40°C to 85°C Data Care Management Power fail protected AES 256 encryption The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications. For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20. E2000 and E2600 are latest upgrades with new high density NAND Flash.
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Description
PCIe M.2 1620 BGA PCIe Gen 3.1 / NVMe 1.3 4 lanes 291 Ball BGA, 0.8mm pitch 16 x 20mm high density 3D NAND TLC / pSLC Operational Temperature Range -40°C to 85°C Data Care Management Power fail protected AES 256 encryption The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications. For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20. E2000 and E2600 are latest upgrades with new high density NAND Flash.
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Datasheet
Datasheet Summary
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The E2600 Series is an industrial-grade PCIe BGA SSD in M.2 1620 BGA form factor (16mm x 20mm x 1.8mm), designed for embedded applications requiring high reliability. It supports PCIe Gen 3.1 x4 and NVMe 1.3, with capacities including 20 GB, and operates across an industrial temperature range of -40 °C to 85 °C (Tambient) and up to 95 °C (Tcase). The device uses 3D NAND Flash with LDPC ECC, end-to-end data protection, and supports power fail data loss protection. Features include dynamic and static wear leveling, S.M.A.R.T., data care management with adaptive read refresh and background media scan, and in-field firmware updates. AES256 encryption and TCG Opal 2.0 are available on request. RoHS and REACH compliant.

Datasheet Summary
Powered by GS/AI

The E2600 Series is an industrial-grade PCIe BGA SSD in M.2 1620 BGA form factor (16mm x 20mm x 1.8mm), designed for embedded applications requiring high reliability. It supports PCIe Gen 3.1 x4 and NVMe 1.3, with capacities including 20 GB, and operates across an industrial temperature range of -40 °C to 85 °C (Tambient) and up to 95 °C (Tcase). The device uses 3D NAND Flash with LDPC ECC, end-to-end data protection, and supports power fail data loss protection. Features include dynamic and static wear leveling, S.M.A.R.T., data care management with adaptive read refresh and background media scan, and in-field firmware updates. AES256 encryption and TCG Opal 2.0 are available on request. RoHS and REACH compliant.

Suppliers

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Industrial BGA PCIe SSD, E2600, 20 GB, 3D PSLC Flash, -40°C to +85°C - SE2600BC020GI-1TB1-1CB-STD - Swissbit AG
Bronschhofen, Switzerland
Industrial BGA PCIe SSD, E2600, 20 GB, 3D PSLC Flash, -40°C to +85°C
SE2600BC020GI-1TB1-1CB-STD
Industrial BGA PCIe SSD, E2600, 20 GB, 3D PSLC Flash, -40°C to +85°C SE2600BC020GI-1TB1-1CB-STD
PCIe M.2 1620 BGA PCIe Gen 3.1 / NVMe 1.3 4 lanes 291 Ball BGA, 0.8mm pitch 16 x 20mm high density 3D NAND TLC / pSLC Operational Temperature Range -40°C to 85°C Data Care Management Power fail protected AES 256 encryption The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications. For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20. E2000 and E2600 are latest upgrades with new high density NAND Flash.
  • PCIe M.2 1620 BGA
  • PCIe Gen 3.1 / NVMe 1.3 4 lanes
  • 291 Ball BGA, 0.8mm pitch 16 x 20mm
  • high density 3D NAND TLC / pSLC
  • Operational Temperature Range -40°C to 85°C
  • Data Care Management
  • Power fail protected
  • AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

Supplier's Site Datasheet

Technical Specifications

  Swissbit AG
Product Category Flash Memory Cards
Product Number SE2600BC020GI-1TB1-1CB-STD
Product Name Industrial BGA PCIe SSD, E2600, 20 GB, 3D PSLC Flash, -40°C to +85°C
Memory Type 3D PSLC
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