HIGH OUTPUT CURRENT WITH THERMAL
HIGH OUTPUT CURRENT WITH THERMAL
HIGH OUTPUT CURRENT WITH THERMAL
HIGH OUTPUT CURRENT WITH THERMAL
CMOS Amplifier 2 Circuit Rail-to-Rail 8-DFN (3x3)
HIGH OUTPUT CURRENT WITH THERMAL
OPAMP, 3.1 MHZ, -40 TO 125DEG C ROHS COMPLIANT: YES
| DigiKey | ODG (Origin Data Global) | Quarktwin Technology Ltd. | Shenzhen Shengyu Electronics Technology Limited | Newark, An Avnet Company | |
|---|---|---|---|---|---|
| Product Category | Operational Amplifiers | Operational Amplifiers | Operational Amplifiers | Operational Amplifiers | Amplifier and Comparator Chips |
| Product Number | 497-TSB582IQ2TDKR-ND | TSB582IQ2T | TSB582IQ2T | TSB582IQ2T | 60AK9201 |
| Product Name | Instrumentation, Op Amps, Buffer Amps | Instrumentation, OP Amps, Buffer Amps | Instrumentation, OP Amps, Buffer Amps | Integrated Circuits (ICs) - Linear - Amplifiers | Opamp, 3.1 Mhz, -40 To 125Deg C Rohs Compliant Stmicroelectronics |
| Features | Rail-Rail-Out | ||||
| Source Current (IS) | 2.5 milliamps | 2.5 milliamps | |||
| Slew Rate | 2 V/µs | 2 V/µs | 2 V/µs | 2.00E-6 V/µs | |
| Operating Temperature | -40 to 125 C (-40 to 257 F) | -40 to 125 C (-40 to 257 F) | -40 to 125 C (-40 to 257 F) | ||
| Package Type | 8-WDFN Exposed Pad | Surface Mount | 8-WDFN Exposed Pad | Surface Mount |
