Qnnect, formerly Hermetic Solutions Group Implantable Packaging

Description
Qnnect, formerly Hermetic Solutions Group leads the way in overcoming some of the challenges faced by medical implant designers. We developed a ceramic-to-metal joining technology to make medical components smaller without sacrificing performance. Our RF transparent ceramic case technology enables device manufacturers to communicate to devices from outside the body. With smaller components and strengthening advancements, we have increased the durability of implantable devices. We’ve also helped to overcome rejection issues by designing devices using materials with a proven track record of implantable viability. Vacuum Brazing/Diffusion Bonding: We employ processes that join dissimilar materials such as titanium, alumina, zirconia, and more. We’ve been making medical feedthroughs and assemblies for decades. Proven Implantable Viability: Our packaging designs address potential rejection issues by using materials with a proven track record of implantable viability. For example, we utilize advanced ceramic materials in housings that enable a cochlear implant to reside safely within the human body. Smaller, More Durable Components: Qnnect, formerly Hermetic Solutions Group has developed a ceramic-to-metal joining technology to make components smaller without compromising performance. Our RF transparent ceramic enables communication with an implanted from outside the body. Using smaller components and strengthening advancements, we have increased the durability of implantable medical devices. Kryoflex®: A family of polycrystalline ceramics developed to hermetically sealing together materials used in electrical feedthroughs and is very effective at prohibiting the influx of any fluids or gases into the a package’s internal electronics. Kryoflex® is used in the manufacture of ultra-reliable feedthroughs for a wide variety of implantable devices.
Datasheet
Description
Qnnect, formerly Hermetic Solutions Group leads the way in overcoming some of the challenges faced by medical implant designers. We developed a ceramic-to-metal joining technology to make medical components smaller without sacrificing performance. Our RF transparent ceramic case technology enables device manufacturers to communicate to devices from outside the body. With smaller components and strengthening advancements, we have increased the durability of implantable devices. We’ve also helped to overcome rejection issues by designing devices using materials with a proven track record of implantable viability. Vacuum Brazing/Diffusion Bonding: We employ processes that join dissimilar materials such as titanium, alumina, zirconia, and more. We’ve been making medical feedthroughs and assemblies for decades. Proven Implantable Viability: Our packaging designs address potential rejection issues by using materials with a proven track record of implantable viability. For example, we utilize advanced ceramic materials in housings that enable a cochlear implant to reside safely within the human body. Smaller, More Durable Components: Qnnect, formerly Hermetic Solutions Group has developed a ceramic-to-metal joining technology to make components smaller without compromising performance. Our RF transparent ceramic enables communication with an implanted from outside the body. Using smaller components and strengthening advancements, we have increased the durability of implantable medical devices. Kryoflex®: A family of polycrystalline ceramics developed to hermetically sealing together materials used in electrical feedthroughs and is very effective at prohibiting the influx of any fluids or gases into the a package’s internal electronics. Kryoflex® is used in the manufacture of ultra-reliable feedthroughs for a wide variety of implantable devices.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Implantable Packaging -  - Qnnect, formerly Hermetic Solutions Group
Painesville, OH, United States
Implantable Packaging
Implantable Packaging
Qnnect, formerly Hermetic Solutions Group leads the way in overcoming some of the challenges faced by medical implant designers. We developed a ceramic-to-metal joining technology to make medical components smaller without sacrificing performance. Our RF transparent ceramic case technology enables device manufacturers to communicate to devices from outside the body. With smaller components and strengthening advancements, we have increased the durability of implantable devices. We’ve also helped to overcome rejection issues by designing devices using materials with a proven track record of implantable viability. Vacuum Brazing/Diffusion Bonding: We employ processes that join dissimilar materials such as titanium, alumina, zirconia, and more. We’ve been making medical feedthroughs and assemblies for decades. Proven Implantable Viability: Our packaging designs address potential rejection issues by using materials with a proven track record of implantable viability. For example, we utilize advanced ceramic materials in housings that enable a cochlear implant to reside safely within the human body. Smaller, More Durable Components: Qnnect, formerly Hermetic Solutions Group has developed a ceramic-to-metal joining technology to make components smaller without compromising performance. Our RF transparent ceramic enables communication with an implanted from outside the body. Using smaller components and strengthening advancements, we have increased the durability of implantable medical devices. Kryoflex®: A family of polycrystalline ceramics developed to hermetically sealing together materials used in electrical feedthroughs and is very effective at prohibiting the influx of any fluids or gases into the a package’s internal electronics. Kryoflex® is used in the manufacture of ultra-reliable feedthroughs for a wide variety of implantable devices.

Qnnect, formerly Hermetic Solutions Group leads the way in overcoming some of the challenges faced by medical implant designers. We developed a ceramic-to-metal joining technology to make medical components smaller without sacrificing performance. Our RF transparent ceramic case technology enables device manufacturers to communicate to devices from outside the body. With smaller components and strengthening advancements, we have increased the durability of implantable devices. We’ve also helped to overcome rejection issues by designing devices using materials with a proven track record of implantable viability.

  • Vacuum Brazing/Diffusion Bonding: We employ processes that join dissimilar materials such as titanium, alumina, zirconia, and more. We’ve been making medical feedthroughs and assemblies for decades.
  • Proven Implantable Viability: Our packaging designs address potential rejection issues by using materials with a proven track record of implantable viability. For example, we utilize advanced ceramic materials in housings that enable a cochlear implant to reside safely within the human body.
  • Smaller, More Durable Components: Qnnect, formerly Hermetic Solutions Group has developed a ceramic-to-metal joining technology to make components smaller without compromising performance. Our RF transparent ceramic enables communication with an implanted from outside the body. Using smaller components and strengthening advancements, we have increased the durability of implantable medical devices.
  • Kryoflex®: A family of polycrystalline ceramics developed to hermetically sealing together materials used in electrical feedthroughs and is very effective at prohibiting the influx of any fluids or gases into the a package’s internal electronics. Kryoflex® is used in the manufacture of ultra-reliable feedthroughs for a wide variety of implantable devices.
Supplier's Site Datasheet

Technical Specifications

  Qnnect, formerly Hermetic Solutions Group
Product Category Electronic Packages and Lids
Product Name Implantable Packaging
Package Material Titanium
Unlock Full Specs
to access all available technical data

Similar Products

Infrared Sensor Metal Hermetic Package -  - OptiSpac, Inc.
Specs
Package Material Copper (optional feature); Tungsten (optional feature)
Hermeticity ≤ 1x10-3Pa●cm3/s(He)
Insulation Resistance ≥1x1010Ω(500V●DC)
View Details
Stepped & Flat Lids -  - Qnnect, formerly Hermetic Solutions Group
Qnnect, formerly Hermetic Solutions Group
Specs
Package Material Kovar, stainless steel, Invar, Alloy 42/46/48 as Well as Mild Steel.
View Details
ATG Dual In-Line Header -  - Advanced Technology Group, Inc.
Advanced Technology Group, Inc.
Specs
Package Material Pins and Frame: ASTM F-15 Kovar alloy per Mil-I-23011, Class 1. Glass: Corning 7052 or equivalent.
View Details
WWS Hermetic Package -  - OptiSpac, Inc.
Specs
Package Material Copper (optional feature); Tungsten (optional feature); Aluminum (optional feature)
Hermeticity ≤ 1x10-3Pa●cm3/s(He)
Insulation Resistance ≥1x1010Ω(500V●DC)
View Details