The SUMMIT 2629 integrates novel power amplifiers, low noise amplifiers, T/R switching, beamformers, calibration, gain control, beam table memory, temperature and power telemetry, and high-speed SPI control for a front-end module with optimal partitioning for 5G infrastructure. The SUMMIT 2629 operates from 26.5-29.5 GHz and is the first of a family of MixComm mmWave devices.
MixComm SUMMIT 2629 Product Highlights:
Industry leading efficiency more than 2X better than existing solutions
Four-element Dual-pol. TX/RX with Independent Polarization Beam Directions
High-Power, High-Efficiency SOI CMOS Power Amplifiers
State-of-the-art Low-Noise Amplifiers and Low-Loss T/R Switching
Ultra-low Transmit and Receive-Mode Power Consumption
6-bit full-360 degree Phase Shifting and 0.5dB-step 16dB-range Variable Gain in Each Path
Fully calibrated for Gain/Phase Matching Across ICs
Extensive On-chip Temperature and Power Sensing
On-chip Gain Control for Temperature Compensation
High-Speed SPI with Large On-Chip Beam Table Storage
Wafer-Level Chip-Scale Package (WLCSP) compatible with low-cost PCB manufacturing
Support for Large-Scale Arrays through Multiple Chip-Addressing Modes
The SUMMIT 2629 integrates novel power amplifiers, low noise amplifiers, T/R switching, beamformers, calibration, gain control, beam table memory, temperature and power telemetry, and high-speed SPI control for a front-end module with optimal partitioning for 5G infrastructure. The SUMMIT 2629 operates from 26.5-29.5 GHz and is the first of a family of MixComm mmWave devices.
MixComm SUMMIT 2629 Product Highlights:
- Industry leading efficiency more than 2X better than existing solutions
- Four-element Dual-pol. TX/RX with Independent Polarization Beam Directions
- High-Power, High-Efficiency SOI CMOS Power Amplifiers
- State-of-the-art Low-Noise Amplifiers and Low-Loss T/R Switching
- Ultra-low Transmit and Receive-Mode Power Consumption
- 6-bit full-360 degree Phase Shifting and 0.5dB-step 16dB-range Variable Gain in Each Path
- Fully calibrated for Gain/Phase Matching Across ICs
- Extensive On-chip Temperature and Power Sensing
- On-chip Gain Control for Temperature Compensation
- High-Speed SPI with Large On-Chip Beam Table Storage
- Wafer-Level Chip-Scale Package (WLCSP) compatible with low-cost PCB manufacturing
- Support for Large-Scale Arrays through Multiple Chip-Addressing Modes
