The SM662GXD-BDST is part of the Ferri-eMMC¬Æ series from Quarktwin Technology Ltd., designed for industrial and automotive applications. It complies with JEDEC eMMC 5.1 standards and is available in 100/153-ball BGA packages, facilitating efficient PCB design and manufacturing. This memory solution features advanced NAND management capabilities, including error correction, bad block management, and health monitoring, ensuring high reliability for embedded systems. The product supports a density range of 16GB to 512GB and operates in both TLC and SLC modes. It is suitable for a wide temperature range, with commercial support from -25¬8C to +85¬8C, industrial support from -40¬8C to +85¬8C, and automotive grade options up to +105¬8C. The SM662GXD-BDST also includes robust data protection features, such as power loss protection and secure erase functions, making it a reliable choice for critical applications. Additionally, it offers customization options through firmware, allowing for tailored solutions to specific project requirements.
FERRI-EMMC BGA 100-B EMMC 3D TLC
FERRI-EMMC BGA 100-B EMMC 3D TLC
| DigiKey | Lingto Electronic Limited | Acme Chip Technology Co., Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | SM662GXD-BDST-ND | SM662GXD-BDST | SM662GXD-BDST | SM662GXD-BDST |
| Product Name | Memory | Memory | Integrated Circuits (ICs) - Memory - Memory | Memory |
| Memory Category | Flash |
