Sheldahl Flexible Technologies - a Flex company Busbar Insulation Tape BusBond T9023

Low Flow Flame Retardant Adhesive on Tedlar® Film

Description

T9023 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with Tedlar® film and are designed for laminated busbar applications requiring a formable, UV resistant dielectric material with a comparative tracking index (CTI) of 0. The materials high temperature tolerance provides end-users with solutions that are unattainable with other products.

Features

• Tedlar® film’s excellent abrasion and UV resistance, coupled with excellent tracking properties make it ideal for outer busbar layers.
• T9023 is available in multiple plys as well as combined with other dielectric materials (PET).
• Unique temperature resistant low-flow adhesive makes T9023 ideal for use in laminated busbars requiring more than one lamination process.
• High bond strength provides superior adhesion to copper, aluminum and most plated metals.
• Low variation in adhesive thickness (± 0.1 mil).
• Reduced process time and wide lamination window cuts costs, prevents copper oxidation, and eliminates a major cause of dimensional change.
• T9023 is RoHS compliant.
• Finished products can achieve a UL minimum continuous use temperature rating of 105°C and above.

Low Flow Flame Retardant Adhesive on Tedlar® Film

Description

T9023 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with Tedlar® film and are designed for laminated busbar applications requiring a formable, UV resistant dielectric material with a comparative tracking index (CTI) of 0. The materials high temperature tolerance provides end-users with solutions that are unattainable with other products.

Features

• Tedlar® film’s excellent abrasion and UV resistance, coupled with excellent tracking properties make it ideal for outer busbar layers.
• T9023 is available in multiple plys as well as combined with other dielectric materials (PET).
• Unique temperature resistant low-flow adhesive makes T9023 ideal for use in laminated busbars requiring more than one lamination process.
• High bond strength provides superior adhesion to copper, aluminum and most plated metals.
• Low variation in adhesive thickness (± 0.1 mil).
• Reduced process time and wide lamination window cuts costs, prevents copper oxidation, and eliminates a major cause of dimensional change.
• T9023 is RoHS compliant.
• Finished products can achieve a UL minimum continuous use temperature rating of 105°C and above.