SemiProbe IRIS DIE & Wafer Inspection Systems FA Fully Automatic Inspection System

Description
SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS inspection system has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
Description
SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS inspection system has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.

Suppliers

Company
Product
Description
Supplier Links
IRIS DIE & Wafer Inspection Systems - FA Fully Automatic Inspection System - SemiProbe
Winooski, VT, USA
IRIS DIE & Wafer Inspection Systems
FA Fully Automatic Inspection System
IRIS DIE & Wafer Inspection Systems FA Fully Automatic Inspection System
SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS inspection system has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.

SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS inspection system has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.

Supplier's Site

Technical Specifications

  SemiProbe
Product Category Wafer and Thin Film Instrumentation
Product Number FA Fully Automatic Inspection System
Product Name IRIS DIE & Wafer Inspection Systems
Form Factor ProbingSystem
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