MOSFET Module
Features
Compact Design
One screw mounting
Heat transfer and isolation through direct copper bonded aluminum oxide ceramic (DCB)
Trench Technology
Short internal connections and low inductance case
Typical Applications
Low switched mode power supplies
DC servo drives
UPS
Richardson RFPD
Done
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Datasheet
Description
MOSFET Module
Features
Compact Design
One screw mounting
Heat transfer and isolation through direct copper bonded aluminum oxide ceramic (DCB)
Trench Technology
Short internal connections and low inductance case
Typical Applications
Low switched mode power supplies
DC servo drives
UPS
MOSFET Module
Features
Compact Design
One screw mounting
Heat transfer and isolation through direct copper bonded aluminum oxide ceramic (DCB)
Trench Technology
Short internal connections and low inductance case
Typical Applications
Low switched mode power supplies
DC servo drives
UPS
MOSFET Module
Features
Compact Design
One screw mounting
Heat transfer and isolation through direct copper bonded aluminum oxide ceramic (DCB)
Trench Technology
Short internal connections and low inductance case
