Semikron, Inc. Power IGBT Transistor SEMIX341D16S

Description
SEMiX® offers users a high degree of flexibility in system configuration. Inverters, for instance, can be constructed either with compact sixpacks (SEMiX® 13/33c) or with thermally decoupled half bridges in the same family of housings. This can result in a better thermal spreading effect that can reduce the external thermal resistance by up to 20 %, thus making it possible to increase the current by up to 15 % or reduce the chip temperature by 15...20 K. If these advantages are not made use of, less complex heat sink designs than those in sixpacks are possible.
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Description
SEMiX® offers users a high degree of flexibility in system configuration. Inverters, for instance, can be constructed either with compact sixpacks (SEMiX® 13/33c) or with thermally decoupled half bridges in the same family of housings. This can result in a better thermal spreading effect that can reduce the external thermal resistance by up to 20 %, thus making it possible to increase the current by up to 15 % or reduce the chip temperature by 15...20 K. If these advantages are not made use of, less complex heat sink designs than those in sixpacks are possible.
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Suppliers

Company
Product
Description
Supplier Links
Power IGBT Transistor - SEMIX341D16S - Richardson RFPD
Downers Grove, IL, United States
Power IGBT Transistor
SEMIX341D16S
Power IGBT Transistor SEMIX341D16S
SEMiX® offers users a high degree of flexibility in system configuration. Inverters, for instance, can be constructed either with compact sixpacks (SEMiX® 13/33c) or with thermally decoupled half bridges in the same family of housings. This can result in a better thermal spreading effect that can reduce the external thermal resistance by up to 20 %, thus making it possible to increase the current by up to 15 % or reduce the chip temperature by 15...20 K. If these advantages are not made use of, less complex heat sink designs than those in sixpacks are possible.

SEMiX® offers users a high degree of flexibility in system configuration. Inverters, for instance, can be constructed either with compact sixpacks (SEMiX® 13/33c) or with thermally decoupled half bridges in the same family of housings. This can result in a better thermal spreading effect that can reduce the external thermal resistance by up to 20 %, thus making it possible to increase the current by up to 15 % or reduce the chip temperature by 15...20 K. If these advantages are not made use of, less complex heat sink designs than those in sixpacks are possible.

Supplier's Site Datasheet

Technical Specifications

  Richardson RFPD
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number SEMIX341D16S
Product Name Power IGBT Transistor
Package Type SEMiX 13
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