Sauereisen, Inc. Urethane Filler Compound No. 309

Description
Sauereisen Urethane Filler Compound No. 309 is an urethane formulation specifically designed to fill voids, irregularities, and air pockets in concrete. The filler compound provides a uniform surface for the application of Sauereisen ConoFlex Urethane No. 381.
Description
Sauereisen Urethane Filler Compound No. 309 is an urethane formulation specifically designed to fill voids, irregularities, and air pockets in concrete. The filler compound provides a uniform surface for the application of Sauereisen ConoFlex Urethane No. 381.

Suppliers

Company
Product
Description
Supplier Links
Urethane Filler Compound - No. 309 - Sauereisen, Inc.
Pittsburgh, PA, USA
Urethane Filler Compound
No. 309
Urethane Filler Compound No. 309
Sauereisen Urethane Filler Compound No. 309 is an urethane formulation specifically designed to fill voids, irregularities, and air pockets in concrete. The filler compound provides a uniform surface for the application of Sauereisen ConoFlex Urethane No. 381.

Sauereisen Urethane Filler Compound No. 309 is an urethane formulation specifically designed to fill voids, irregularities, and air pockets in concrete. The filler compound provides a uniform surface for the application of Sauereisen ConoFlex Urethane No. 381.

Supplier's Site

Technical Specifications

  Sauereisen, Inc.
Product Category Industrial Sealants
Product Number No. 309
Product Name Urethane Filler Compound
Cure / Technology Two Component  
Type / Form Liquid; Powder
Substrate Compatibility Concrete, Masonry
Unlock Full Specs
to access all available technical data

Similar Products

1-Part, General Purpose, RTV Silicone Adhesive Sealant - AS5702 - CHT USA Inc.
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Industry Automotive; Electronics
View Details
C-SHIELD RF Conductive Caulking Compound and Sealer -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type / Form Liquid
Features Caulk, Grout; Electrically Conductive
View Details
Thermally Conductive Epoxy Polysulfide Adhesive - EP21TPFL-1AO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Formulations - Applications - Ammunition Sealant - External Ammo Sealant 76083 - 37608330 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details