Samtec Inc. Board to Board & Mezzanine Connectors TMS-132-03-S-D-RA

Description
Through-hole Micro Header, 0.050 x 0.10
  • Board to Board & Mezzanine Connectors - TMS-132-03-S-D-RA - Powell Electronics, Inc.
    Powell Electronics, Inc.
Request a Quote
Description
Through-hole Micro Header, 0.050 x 0.10
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Board to Board & Mezzanine Connectors - TMS-132-03-S-D-RA - Powell Electronics, Inc.
Powell Electronics, Inc.
Swedesboro, NJ, United States
Board to Board & Mezzanine Connectors
TMS-132-03-S-D-RA
Board to Board & Mezzanine Connectors TMS-132-03-S-D-RA
Through-hole Micro Header, 0.050 x 0.10

Through-hole Micro Header, 0.050 x 0.10

Buy Now

Technical Specifications

  Powell Electronics, Inc.
Product Category IC Interconnect Components
Product Number TMS-132-03-S-D-RA
Product Name Board to Board & Mezzanine Connectors
Product Type IC Headers
Unlock Full Specs
to access all available technical data

Related Documents

Similar Products

PCB Headers & Receptacles - 103322-6 - TE Connectivity
TE Connectivity
PCB Headers & Receptacles
103322-6
Specs
Product Type IC Headers
Mounting Board Mount
Current Rating 3 amps
View Details
Btb Conn, Header, 32Pos, 2Row, 1Mm Rohs Compliant Amphenol Communications Solutions - 85AH6341 - Newark, An Avnet Company
Amphenol Communications Solutions
Btb Conn, Header, 32Pos, 2Row, 1Mm Rohs Compliant Amphenol Communications Solutions
10150098-3200RLF
Specs
Product Type IC Headers
RoHS Compliant RoHS Compliant
View Details
Headers & Wire Housings - B5743-218-M-T-1 - Powell Electronics, Inc.
Harwin Plc
Headers & Wire Housings
B5743-218-M-T-1
Specs
Product Type IC Headers
View Details
718 Series CSP/BGA/QFN Devices Lidded - - Sensata Technologies
Sensata Technologies
718 Series CSP/BGA/QFN Devices Lidded
Specs
Product Type IC Socket
Contact Resistance 350 milliohms
Operating Temperature 125 C (257 F)
View Details