Samsung Electro-Mechanics WiFi Combo Module

Description
A Wi-Fi combo module is a short-distance wireless communication module that provides wireless Internet or communication between devices. Small and thin parts as well as a miniaturization package method are applied to provide high-density and miniaturized module solutions. General Features IEEE 802.11 a/b/g/n/ac Standard Compliant Low Power Consumption Compact Design RoHS Compliant Application Smartphone, Tablet, Note PC CE(Consumer Electronics) Wearable Devices Why Samsung Features of Products (Technology) Adoption of new standard technologies in advance to provide high-speed wireless communication Design optimization for high performance and low power–consumption characteristics Application of high-density and miniaturization package methods Short-distance wireless communication technology Matching between high-frequency transmision and reception to provide necessary communication speed and coverage Complex / miniaturized high-frequency circuit design technology High-density miniaturized wireless communication module Designand analysis of high-density wiring for various DC power and digital interface signals, including high-frequency signals (signal integrity, power integrity) Reduction of the characteristics of channels within a frequency band for securing stable communication speed and distance High-frequency(RF) signal processing IC and matching technology Application of high performance and low power–consumption characteristics of the high-frequency signal processing IC that amplifies and switches high-frequency signals Matching of high-frequency input and output signals (high-frequency transmitting path and LC parts) Miniaturization package processing technology Development of a process for a thin and miniaturized package (the ball gap is reduced as ICs get highly densed) Package processing technology for the increase in the IC ball density and the parts mounting density Structure View Double-Sided Mounting Module Structure : A structure for mounting parts on the top and bottom surfaces Single-Sided Mounting Module Structure : A structure for mounting parts on the top surface
Description
A Wi-Fi combo module is a short-distance wireless communication module that provides wireless Internet or communication between devices. Small and thin parts as well as a miniaturization package method are applied to provide high-density and miniaturized module solutions. General Features IEEE 802.11 a/b/g/n/ac Standard Compliant Low Power Consumption Compact Design RoHS Compliant Application Smartphone, Tablet, Note PC CE(Consumer Electronics) Wearable Devices Why Samsung Features of Products (Technology) Adoption of new standard technologies in advance to provide high-speed wireless communication Design optimization for high performance and low power–consumption characteristics Application of high-density and miniaturization package methods Short-distance wireless communication technology Matching between high-frequency transmision and reception to provide necessary communication speed and coverage Complex / miniaturized high-frequency circuit design technology High-density miniaturized wireless communication module Designand analysis of high-density wiring for various DC power and digital interface signals, including high-frequency signals (signal integrity, power integrity) Reduction of the characteristics of channels within a frequency band for securing stable communication speed and distance High-frequency(RF) signal processing IC and matching technology Application of high performance and low power–consumption characteristics of the high-frequency signal processing IC that amplifies and switches high-frequency signals Matching of high-frequency input and output signals (high-frequency transmitting path and LC parts) Miniaturization package processing technology Development of a process for a thin and miniaturized package (the ball gap is reduced as ICs get highly densed) Package processing technology for the increase in the IC ball density and the parts mounting density Structure View Double-Sided Mounting Module Structure : A structure for mounting parts on the top and bottom surfaces Single-Sided Mounting Module Structure : A structure for mounting parts on the top surface

Suppliers

Company
Product
Description
Supplier Links
WiFi Combo Module -  - Samsung Electro-Mechanics
Paldal-gu Suwon-si, Gyeonggi-do, Korea
WiFi Combo Module
WiFi Combo Module
A Wi-Fi combo module is a short-distance wireless communication module that provides wireless Internet or communication between devices. Small and thin parts as well as a miniaturization package method are applied to provide high-density and miniaturized module solutions. General Features IEEE 802.11 a/b/g/n/ac Standard Compliant Low Power Consumption Compact Design RoHS Compliant Application Smartphone, Tablet, Note PC CE(Consumer Electronics) Wearable Devices Why Samsung Features of Products (Technology) Adoption of new standard technologies in advance to provide high-speed wireless communication Design optimization for high performance and low power–consumption characteristics Application of high-density and miniaturization package methods Short-distance wireless communication technology Matching between high-frequency transmision and reception to provide necessary communication speed and coverage Complex / miniaturized high-frequency circuit design technology High-density miniaturized wireless communication module Designand analysis of high-density wiring for various DC power and digital interface signals, including high-frequency signals (signal integrity, power integrity) Reduction of the characteristics of channels within a frequency band for securing stable communication speed and distance High-frequency(RF) signal processing IC and matching technology Application of high performance and low power–consumption characteristics of the high-frequency signal processing IC that amplifies and switches high-frequency signals Matching of high-frequency input and output signals (high-frequency transmitting path and LC parts) Miniaturization package processing technology Development of a process for a thin and miniaturized package (the ball gap is reduced as ICs get highly densed) Package processing technology for the increase in the IC ball density and the parts mounting density Structure View Double-Sided Mounting Module Structure : A structure for mounting parts on the top and bottom surfaces Single-Sided Mounting Module Structure : A structure for mounting parts on the top surface

A Wi-Fi combo module is a short-distance wireless communication module that provides wireless Internet or communication between devices.

Small and thin parts as well as a miniaturization package method are applied to provide high-density and miniaturized module solutions.

General Features

  • IEEE 802.11 a/b/g/n/ac Standard Compliant
  • Low Power Consumption
  • Compact Design
  • RoHS Compliant

Application

  • Smartphone, Tablet, Note PC
  • CE(Consumer Electronics)
  • Wearable Devices

Why Samsung

Features of Products (Technology)

Adoption of new standard technologies in advance to provide high-speed wireless communication

Design optimization for high performance and low power–consumption characteristics

Application of high-density and miniaturization package methods

Short-distance wireless
communication technology
  • Matching between high-frequency transmision and reception to provide necessary communication speed and coverage
Complex / miniaturized
high-frequency circuit
design technology
  • High-density miniaturized wireless communication module
  • Designand analysis of high-density wiring for various DC power and digital interface signals, including high-frequency signals (signal integrity, power integrity)
  • Reduction of the characteristics of channels within a frequency band for securing stable communication speed and distance
High-frequency(RF)
signal processing
IC and matching technology
  • Application of high performance and low power–consumption characteristics of the high-frequency signal processing IC that amplifies and switches high-frequency signals
  • Matching of high-frequency input and output signals (high-frequency transmitting path and LC parts)
Miniaturization
package processing technology
  • Development of a process for a thin and miniaturized package (the ball gap is reduced as ICs get highly densed)
  • Package processing technology for the increase in the IC ball density and the parts mounting density

Structure View

Double-Sided Mounting Module Structure : A structure for mounting parts on the top and bottom surfaces

Single-Sided Mounting Module Structure : A structure for mounting parts on the top surface

Supplier's Site

Technical Specifications

  Samsung Electro-Mechanics
Product Category Network and Communication Chips
Product Name WiFi Combo Module
Technology Wi-Fi / WiMAX / Wi-Mesh
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