Samsung Electronics Co., Ltd. Memory - RAM - K4H561638F-TCB3000 K4H561638F-TCB3000

Description
Manufacturer: Samsung Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 1029277-K4H561638F-T CB3000 Mounting: SMD (SMT) Operating Supply Voltage: 2.5 V Access Time: 700 ps Density: 256 Mb Number of Pins: 66 Categories: RAM Case / Package: TSOP Max Frequency: 333 MHz Alternative Parts (Cross-Reference): K4H561638F-TCB3000K4 H561638FTCB3000; Popularity: Low Fake Threat In the Open Market: 38 pct. Supply and Demand Status: Shortage Maximum Operating Temperature: 70 °C Data Bus Width: 16 b Mount: Surface Mount RoHS: Non-Compliant Radiation Hardening: No Min Operating Temperature: 0 °C Max Supply Voltage: 2.7 V Min Supply Voltage: 2.3 V Nominal Supply Current: 350 mA Address Bus Width: 15 b
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Description
Manufacturer: Samsung Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 1029277-K4H561638F-T CB3000 Mounting: SMD (SMT) Operating Supply Voltage: 2.5 V Access Time: 700 ps Density: 256 Mb Number of Pins: 66 Categories: RAM Case / Package: TSOP Max Frequency: 333 MHz Alternative Parts (Cross-Reference): K4H561638F-TCB3000K4 H561638FTCB3000; Popularity: Low Fake Threat In the Open Market: 38 pct. Supply and Demand Status: Shortage Maximum Operating Temperature: 70 °C Data Bus Width: 16 b Mount: Surface Mount RoHS: Non-Compliant Radiation Hardening: No Min Operating Temperature: 0 °C Max Supply Voltage: 2.7 V Min Supply Voltage: 2.3 V Nominal Supply Current: 350 mA Address Bus Width: 15 b
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Suppliers

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Product
Description
Supplier Links
Memory - RAM - K4H561638F-TCB3000 - 1029277-K4H561638F-TCB3000 - Win Source Electronics
Laguna Hills, CA, United States
Memory - RAM - K4H561638F-TCB3000
1029277-K4H561638F-TCB3000
Memory - RAM - K4H561638F-TCB3000 1029277-K4H561638F-TCB3000
Manufacturer: Samsung Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 1029277-K4H561638F-T CB3000 Mounting: SMD (SMT) Operating Supply Voltage: 2.5 V Access Time: 700 ps Density: 256 Mb Number of Pins: 66 Categories: RAM Case / Package: TSOP Max Frequency: 333 MHz Alternative Parts (Cross-Reference): K4H561638F-TCB3000K4 H561638FTCB3000; Popularity: Low Fake Threat In the Open Market: 38 pct. Supply and Demand Status: Shortage Maximum Operating Temperature: 70 °C Data Bus Width: 16 b Mount: Surface Mount RoHS: Non-Compliant Radiation Hardening: No Min Operating Temperature: 0 °C Max Supply Voltage: 2.7 V Min Supply Voltage: 2.3 V Nominal Supply Current: 350 mA Address Bus Width: 15 b

Manufacturer: Samsung
Storage Condition: Dry storage cabinet & Humidity protection package
Win Source Part Number: 1029277-K4H561638F-TCB3000
Mounting: SMD (SMT)
Operating Supply Voltage: 2.5 V
Access Time: 700 ps
Density: 256 Mb
Number of Pins: 66
Categories: RAM
Case / Package: TSOP
Max Frequency: 333 MHz
Alternative Parts (Cross-Reference): K4H561638F-TCB3000K4H561638FTCB3000;
Popularity: Low
Fake Threat In the Open Market: 38 pct.
Supply and Demand Status: Shortage
Maximum Operating Temperature: 70 °C
Data Bus Width: 16 b
Mount: Surface Mount
RoHS: Non-Compliant
Radiation Hardening: No
Min Operating Temperature: 0 °C
Max Supply Voltage: 2.7 V
Min Supply Voltage: 2.3 V
Nominal Supply Current: 350 mA
Address Bus Width: 15 b

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Memory IC and Storage Component - 774-K4H561638F-TCB3000 - ERSAELECTRONICS PTE. LTD.
Singapore, Singapore
Memory IC and Storage Component
774-K4H561638F-TCB3000
Memory IC and Storage Component 774-K4H561638F-TCB3000
Product overview: K4H561638F-TCB3000 from SAMSUNG is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-K4H561638F-TCB30 00 can be used for catalog matching and distributor lookup.

Product overview: K4H561638F-TCB3000 from SAMSUNG is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-K4H561638F-TCB3000 can be used for catalog matching and distributor lookup.

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Technical Specifications

  Win Source Electronics ERSAELECTRONICS PTE. LTD.
Product Category Memory Chips Memory Chips
Product Number 1029277-K4H561638F-TCB3000 774-K4H561638F-TCB3000
Product Name Memory - RAM - K4H561638F-TCB3000 Memory IC and Storage Component
Access Time 0.7000 ns 0.7000 ns
Operating Temperature 0 C (32 F) 0 C (32 F)
Density 256000 kbits 256000 kbits
Package Type SOP; TSOP TSOP
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