Saint-Gobain Tape Solutions Gasketing Foams, Silicone, Thermally Conductive Silicone ThermaCool TC100U

Description
ThermaCool TC100U is an uncured (B-Stage) unsupported thermally conductive solid silicone rubber. This unique thermally conductive silicone gap filler can be used to effectively bond small passive heat sinks to BGA chips. Applications: Automotive Electronics Computers CD-ROM Cooling Electrical Insulation Military Medical Heat Pipe Assemblies Telecommunication Electronic modules for power devices for power supplies
  • Gasketing Foams, Silicone, Thermally Conductive Silicone - ThermaCool TC100U - Saint-Gobain Tape Solutions
    Saint-Gobain Tape Solutions
Datasheet
Description
ThermaCool TC100U is an uncured (B-Stage) unsupported thermally conductive solid silicone rubber. This unique thermally conductive silicone gap filler can be used to effectively bond small passive heat sinks to BGA chips. Applications: Automotive Electronics Computers CD-ROM Cooling Electrical Insulation Military Medical Heat Pipe Assemblies Telecommunication Electronic modules for power devices for power supplies
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Gasketing Foams, Silicone, Thermally Conductive Silicone - ThermaCool TC100U - Saint-Gobain Tape Solutions
Saint-Gobain Tape Solutions
Hoosick Falls, NY, USA
Gasketing Foams, Silicone, Thermally Conductive Silicone
ThermaCool TC100U
Gasketing Foams, Silicone, Thermally Conductive Silicone ThermaCool TC100U
ThermaCool TC100U is an uncured (B-Stage) unsupported thermally conductive solid silicone rubber. This unique thermally conductive silicone gap filler can be used to effectively bond small passive heat sinks to BGA chips. Applications: Automotive Electronics Computers CD-ROM Cooling Electrical Insulation Military Medical Heat Pipe Assemblies Telecommunication Electronic modules for power devices for power supplies

ThermaCool TC100U is an uncured (B-Stage) unsupported thermally conductive solid silicone rubber. This unique thermally conductive silicone gap filler can be used to effectively bond small passive heat sinks to BGA chips.

Applications:

  • Automotive Electronics
  • Computers
  • CD-ROM Cooling
  • Electrical Insulation
  • Military
  • Medical
  • Heat Pipe Assemblies
  • Telecommunication
  • Electronic modules for power devices for power supplies
Supplier's Site Datasheet

Technical Specifications

  Saint-Gobain Tape Solutions
Product Category Gaskets and Gasketing
Product Number ThermaCool TC100U
Product Name Gasketing Foams, Silicone, Thermally Conductive Silicone
Material Foam; Silicone Rubber
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