Saint-Gobain Surface Conditioning Group High Purity, Waterless Cleaner AmberClean™ 203i

AmberClean™ 203i High Purity, Waterless Cleaner AmberClean™ 203i is a high purity waterless cleaner with a low surface tension that facilitates the removal of process fluids, residues and other contaminants associated with electronic components such as printed circuit boards. AmberClean 203i is also formulated with special corrosion inhibitors to eliminate the corrosion potential of GMR and advanced head designs. It is not flammable, but can be dried from parts using clean dry air, nitrogen or other inert gases. AmberClean 203i can be used in wipe, immersion with or without agitation, ultrasonic or spray applications. Features & Benefits Low surface tension of 30 dynes / cm Cleans combinations of process fluids and their residues effectively Will not corrode exotic alloys used in GMR and advances heads Biodegradable and poses no environmental or health risks Will not etch Al, Ni, and Fe alloys, manganese, copper or cobalt Contains no water for critical GMR requirements Contains no corrosive anions, such as chloride, sulfate or fluoride Will not leave films or residues