SAE International Polyimide Printed Circuit Boards Fabrication of ARP1612A

Description
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
Description
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.

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Polyimide Printed Circuit Boards Fabrication of - ARP1612A - SAE International
Warrendale, PA, United States
Polyimide Printed Circuit Boards Fabrication of
ARP1612A
Polyimide Printed Circuit Boards Fabrication of ARP1612A
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.

This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.

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Technical Specifications

  SAE International
Product Category Standards and Technical Documents
Product Number ARP1612A
Product Name Polyimide Printed Circuit Boards Fabrication of
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