SAE International POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible AMS3731/10C

Description
This specification covers an unfilled, room-temperature-pol ymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.
  • POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible - AMS3731/10C - SAE International
    SAE International
Description
This specification covers an unfilled, room-temperature-pol ymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.

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POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible - AMS3731/10C - SAE International
SAE International
Warrendale, PA, United States
POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible
AMS3731/10C
POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible AMS3731/10C
This specification covers an unfilled, room-temperature-pol ymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.

This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.

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Technical Specifications

  SAE International
Product Category Standards and Technical Documents
Product Number AMS3731/10C
Product Name POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible
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